Fluorene Compound Photoresist for High-NA Pattern Integrity
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Solution Overview
Problem
High-density packaging demands require improved pattern refinement and increased film thickness, but chemically amplified positive-type photoresist compositions struggle to maintain sectional shape integrity when using exposure devices with high lens numerical aperture, leading to deterioration in resist patterns.
Innovation Solution
Incorporating a fluorene compound with a specific structure into the chemically amplified positive-type photosensitive resin composition, which includes an acid generator and a resin that increases alkali solubility, to form a resist pattern that suppresses deterioration even with high lens numerical aperture exposure devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If exposure is carried out with an exposure device having a high lens numerical aperture to refine patterns, then pattern refinement is improved, but deterioration in sectional shape of resist pattern occurs
Solution Approach 1:
The invention changes the chemical composition parameters of the photoresist by incorporating a specific fluorene compound (formula 1) with defined structural parameters (k1-k4 integers, specific functional groups R1-R4). This compositional parameter change enables the resist to maintain sectional shape integrity while achieving pattern refinement with high NA exposure devices.
Solution Approach 2:
The invention creates a composite photoresist system combining the fluorene compound (formula 1) with an acid generator and a base resin. This composite material formulation synergistically improves both pattern refinement capability and sectional shape maintenance, resolving the contradiction between high NA exposure benefits and resist pattern deterioration.
2Volume of moving object
If film thickness is increased to meet high-density packaging requirements, then packaging capacity is improved, but deterioration in resist pattern shape occurs
Solution Approach 1:
The invention modifies the chemical parameters of the photoresist composition by incorporating the fluorene compound (formula 1) with specific structural characteristics. This parameter change enables thicker film formulations to maintain their sectional shape integrity during high NA exposure, allowing increased film thickness without shape deterioration.
3Ease of manufacture
If conventional chemically amplified positive-type photoresist composition is used, then manufacturing process is simple, but deterioration in resist pattern shape occurs with high lens numerical aperture
Solution Approach 1:
The invention develops a composite photoresist formulation that integrates the fluorene compound (formula 1) with conventional acid generators and base resins. This composite approach maintains the simplicity of the manufacturing process while adding the functional benefits of shape maintenance during high NA exposure, resolving the contradiction between process simplicity and pattern quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains the sectional shape of resist patterns and enhances the depth of focus margin, enabling the formation of high-quality resist patterns suitable for high-density packaging applications.
Implementation Method 1
an acid is generated from the acid generator upon irradiation with radiation (exposure) and diffusion of the acid is promoted through heat treatment to cause an acid catalytic reaction with a base resin and the like in the composition, resulting in a change in the alkali-solubility thereof
Implementation Method 2
diffusion of the acid is promoted through heat treatment to cause an acid catalytic reaction
Data Source
AI summary
A photosensitive resin composition, a method of manufacturing a substrate with a template using the composition, and a method of manufacturing a plated article using the substrate with a template. The photosensitive resin composition may be used to form a plated article on a metal surface of a substrate The composition includes an acid generator that, when irradiated with an active ray or radiation, generates an acid, a resin that, under an action of an acid, undergoes an increase in solubility thereof in alkali, and a fluorene compound represented by the formula (1).