Fluorescence Thermometry for Epoxy Resin Packaging
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Solution Overview
Problem
Current temperature measuring techniques for epoxy resin in electronics packaging are inadequate for accurately and reliably measuring temperature during temperature-sensitive processes, particularly when processing multiple packages simultaneously.
Innovation Solution
A fluorescence-based temperature measurement system using an excitation light source and signal analyzer to detect fluorescent light emitted by the epoxy resin, allowing for accurate and real-time temperature determination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If contact thermometry or infrared pyrometers are used to measure temperature, then temperature measurement is possible, but measurement precision and reliability are insufficient
Solution Approach 1:
The patent replaces contact thermometry (mechanical contact-based measurement) and infrared pyrometry with fluorescence-based optical measurement. The system uses excitation light sources to induce fluorescence in the epoxy resin, and detects the emitted fluorescent light intensity to determine temperature, eliminating the limitations of conventional methods and achieving superior measurement precision and reliability.
Solution Approach 2:
The patent utilizes the temperature-dependent parameter change of fluorescent light intensity emitted by the epoxy resin. As temperature changes, the fluorescent light intensity changes in a predictable manner, allowing temperature to be measured with high precision by monitoring this optical parameter change rather than using conventional thermal measurement techniques.
2Productivity
If conventional temperature measuring techniques are used, then temperature can be measured, but the ability to measure temperature during batch processing of multiple packages is inadequate
Solution Approach 1:
The fluorescence-based temperature measurement system is designed to measure temperature across multiple packages simultaneously within a batch. The excitation light source can illuminate and the signal analyzer can detect fluorescent signals from multiple epoxy resin regions at once, enabling universal temperature monitoring for entire batches rather than individual points, thus maintaining measurement precision while enabling batch processing.
3Productivity
If temperature-sensitive processes are performed on batches of multiple packages to enhance throughput, then productivity increases, but temperature measurement and control uniformity deteriorates
Solution Approach 1:
The patent implements a feedback mechanism where the fluorescence-based temperature measurement system continuously monitors temperature across the batch of packages during temperature-sensitive processes. This real-time temperature data feeds back to the temperature-sensitive process control system, enabling dynamic adjustment of heating parameters to maintain uniform temperature distribution across all packages, thus preserving manufacturing precision while enabling batch processing for high throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides improved process uniformity and rapid corrective intervention by enabling precise and fast temperature measurement of epoxy resin during encapsulation, enhancing the quality of electronics packaging processes.
Implementation Method 1
an output apparatus including at least a signal analyzer disposed outside the chamber body to detect fluorescent light energy emitted by the portion of the epoxy resin
Data Source
AI summary
Methods and apparatus for measuring the temperature of epoxy resin in an electronics package are provided herein. In some embodiments, apparatus for encapsulating an electronics package includes: a process chamber having a chamber body enclosing a processing volume; a substrate support having a support surface for receiving and supporting a substrate for forming an electronics package; and a temperature sensor to measure a temperature of an epoxy resin in an electronics package. The temperature sensor includes: an input apparatus including at least a light source disposed outside the chamber body to provide an excitation light energy to a portion of the epoxy resin; and an output apparatus including at least a signal analyzer disposed outside the chamber body to detect fluorescent light energy emitted by the portion of the epoxy resin and determine a temperature of the epoxy resin based on the excitation light energy and the fluorescent light energy.