Fluorescent Alignment Mark Layout for Precise Wafer Recognition
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Solution Overview
Problem
The scaling down of semiconductor devices poses challenges in achieving improved quality, yield, performance, and reliability, particularly in the wafer fabrication process, where alignment marks are critical for precision but often fail to enhance optical recognition effectively.
Innovation Solution
The semiconductor device incorporates a subset of solid and spaced alignment marks with a fluorescence material, positioned strategically on and above the substrate, including first and second-layer-alignment marks in conductive and insulating layers, to improve optical recognition during the fabrication process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional alignment marks are used in scaled-down semiconductor devices, then manufacturing complexity is reduced, but optical recognition capability deteriorates
Solution Approach 1:
The alignment marks incorporate fluorescence materials that change their optical parameters by emitting light at specific wavelengths when excited. This parameter change enables the alignment marks to be clearly recognized optically even in scaled-down semiconductor devices, resolving the contradiction between reduced complexity and deteriorated optical recognition.
Solution Approach 2:
The fluorescence materials in the alignment marks emit light at different wavelengths (colors) when excited, creating distinct visual signals for optical recognition. This color change property allows the alignment marks to stand out clearly during the fabrication process, addressing the optical recognition issue without increasing structural complexity.
2Area of stationary object
If alignment marks are positioned closely together to save space, then device area is reduced, but alignment precision deteriorates
Solution Approach 1:
The fluorescence materials act as intermediaries that enhance the visibility and detectability of alignment marks. By using materials with distinct fluorescence properties, multiple alignment marks can be clearly distinguished even when positioned closely together, maintaining alignment precision while saving substrate area.
3Ease of manufacture
If conventional non-fluorescent alignment marks are used, then manufacturing cost is low, but optical recognition during fabrication deteriorates
Solution Approach 1:
The alignment marks are formed as composite structures incorporating fluorescence materials combined with conventional materials. This composite approach enables optical recognition enhancement through fluorescence properties while maintaining compatibility with existing manufacturing processes and keeping costs relatively low.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of fluorescence material in alignment marks enhances optical recognition, thereby improving the yield of semiconductor device fabrication by ensuring better alignment and precision in the wafer fabrication process.
Implementation Method 1
The first subset of solid alignment marks and the first subset of spaced alignment marks include a fluorescence material
Data Source
AI summary
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a first subset of solid alignment marks positioned over a substrate and including: a first-layer-alignment mark positioned on the substrate, and a second-layer-alignment mark positioned above and deviated from the first-layer-alignment mark of the first subset of solid alignment marks; and a first subset of spaced alignment marks positioned over the substrate, distant from the first subset of solid alignment marks, and including: a first-layer-alignment mark positioned on the substrate and distant from the first-layer-alignment mark of the first subset of solid alignment marks, and a second-layer-alignment mark positioned above and deviated from the first-layer-alignment mark of the first subset of spaced alignment marks. The first subset of solid alignment marks and the first subset of spaced alignment marks include a fluorescence material.