Fluorescent IC Markers for Authenticity and Tamper Verification

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Solution Overview

Problem

The increasing concern of unauthorized modifications in integrated circuits (ICs) makes it difficult to verify the authenticity and integrity of IC products, especially in global manufacturing partnerships where control over sensitive events and supply chain transfers is crucial.

Innovation Solution

Incorporating a layer of fluorescent material on IC components that serves as an identification marker, allowing for verification through comparison with a verification map using radiation detection, ensuring the IC's authenticity and detecting any unauthorized modifications.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional IC manufacturing processes are used without additional verification features, then manufacturing simplicity is maintained, but the ability to detect unauthorized modifications is insufficient

Engineering Contradiction:
Improveauthenticity verificationVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The fluorescent material layer is deposited on IC components during the manufacturing process before the product is released. This preliminary action embeds the verification feature into the product structure, enabling future authentication without requiring additional components or post-manufacturing modifications.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The fluorescent material serves as an intermediary verification layer between the IC component and the authentication system. This mediator enables non-destructive verification by interacting with radiation to produce detectable signals, allowing authenticity confirmation without directly modifying the IC's functional structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If fluorescent material layers are added to IC components for verification, then unauthorized modifications can be detected, but manufacturing complexity increases

Engineering Contradiction:
Improveintegrity verificationVSAvoidmanufacturing process simplicity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The fluorescent material deposition is merged with the existing IC manufacturing process flow. The layer is applied to IC components using standard deposition techniques already present in semiconductor fabrication, combining the verification feature creation with routine manufacturing operations to minimize additional complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The fluorescent material layer serves multiple functions: it provides authentication verification, can indicate specific component identities or batches, and maintains electrical insulation properties. This multi-functionality justifies the added manufacturing step by delivering multiple benefits from a single material addition.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Loss of information

If verification methods using fluorescent material are implemented, then supply chain control is improved, but detection and measurement complexity increases

Engineering Contradiction:
Improveverification informationVSAvoidfluorescent material detection
Core Design Contradiction:
Loss of informationVSDifficulty of detecting and measuring

Solution Approach 1:

The fluorescent material exhibits characteristic photoluminescence when exposed to radiation, emitting light at specific wavelengths that serve as its optical fingerprint. This color/wavelength characteristic enables straightforward detection and differentiation from other materials, simplifying the measurement process despite the need for specialized equipment.

Inventive Principle:
Principle #32Color changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a reliable method to verify the authenticity of ICs by detecting the presence and location of fluorescent material, effectively preventing unauthorized modifications and ensuring the integrity of IC products throughout the supply chain.

Implementation Method 1

a layer of fluorescent material on an IC component, wherein the layer of fluorescent material defines a portion of an identification marker for the IC structure

Methodology Applied
Scientific EffectFluorescence: Fluorescence

Data Source

PatentUS11901304B2Integrated circuit structure with fluorescent material, and related methods
Publication Date: 2024.02.13 GLOBALFOUNDRIES US INC
  • US11901304B2 patent drawing
  • US11901304B2 patent drawing
  • US11901304B2 patent drawing

AI summary

The disclosure provides an integrated circuit (IC) structure with fluorescent materials, and related methods. An IC structure according to the disclosure may include a layer of fluorescent material on an IC component. The layer of fluorescent material defines a portion of an identification marker for the IC structure.