LED Lighting Substrate With Fluorescent Molding for Color Control
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Solution Overview
Problem
There is a need for improved lighting apparatuses that offer better light quality, flexibility, and cost-effectiveness, particularly in LED-based devices that can be used for decorative purposes or to create specific light effects, while considering the design complexity and cost factors.
Innovation Solution
A lighting apparatus comprising a substrate with semiconductor light chips, lead terminals, and a molding module containing fluorescent materials that adjust light characteristics, along with a flexible sheet for electricity transmission and a bulb housing for driver modules, allowing for customizable light output and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If LED lighting is used for illumination, then energy efficiency and lifetime are improved, but initial cost and design complexity increase
Solution Approach 1:
The lighting apparatus is divided into modular components: a substrate with integrated wiring layers, multiple semiconductor light chips mounted on the substrate, and a molding module containing fluorescent material. This segmentation allows independent optimization of each component while maintaining overall system efficiency and reducing design complexity through standardization.
Solution Approach 2:
The substrate integrates multiple functions including mechanical support for light chips, electrical wiring layers for power and signal transmission, and mounting structures for lead terminals. By merging these functions into a single substrate component, the design reduces the number of separate parts and simplifies assembly while maintaining high energy efficiency.
2Adaptability or versatility
If multiple semiconductor light chips are mounted on a substrate, then light output and flexibility are improved, but manufacturing precision requirements increase
Solution Approach 1:
The substrate is designed with differentiated regions: a bridge part for mounting semiconductor light chips with specific spacing, wiring layers with optimized trace widths and spacing for electrical connections, and lead terminal mounting areas. This local differentiation allows precise control of light chip positioning and electrical connections while maintaining overall manufacturing feasibility.
Solution Approach 2:
The substrate is pre-configured with wiring layers, mounting structures, and lead terminal connections before the semiconductor light chips are mounted. This preliminary preparation ensures precise positioning and electrical connectivity, reducing the precision requirements during the actual chip mounting process and enabling flexible light output configurations.
3Illumination intensity
If fluorescent material is used to adjust light parameters, then light quality and color temperature are improved, but manufacturing cost increases
Solution Approach 1:
Fluorescent material is introduced as an intermediary component within the molding module that converts the light output from semiconductor light chips to achieve desired color temperatures and quality characteristics. This intermediary approach allows independent optimization of the light chip performance and the final light output characteristics, maintaining manufacturing efficiency while improving light quality.
Solution Approach 2:
The molding module combines fluorescent material with other encapsulating materials to create a composite structure that provides both optical transformation functions and mechanical protection. This composite approach integrates multiple functions into a single component, reducing the number of separate parts and simplifying manufacturing while achieving superior light quality and color temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced light quality and flexibility, enabling customizable light patterns and efficient energy use, while maintaining a cost-effective design.
Implementation Method 1
The molding module is mixed with fluorescent material enclosing the bridge part of the substrate and the multiple semiconductor light chips. A light parameter emitted from one semiconductor light chip is adjusted when passing through the fluorescent material.
Data Source
AI summary
A lighting apparatus includes a first lead terminal, a second lead terminal, a substrate, multiple semiconductor light chips and a molding module. The substrate has wiring layer. The wiring layer is composed one or multiple metal wires, metal strips or other electrical conductive patterns on the substrate. The multiple semiconductor light chips are mounted on a bridge part of the substrate. The first lead terminal and the second lead terminal are attached on opposite sides of the bridge part. The multiple semiconductor light chips are electrically connected to the first lead terminal and the second lead terminal via the wiring layer. The molding module is mixed with fluorescent material enclosing the bridge part of the substrate and the multiple semiconductor light chips.