Fluorescent Photosensitive Resin for Permanent Resist Inspection
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Solution Overview
Problem
Current methods for inspecting the appearance of permanent resists in printed circuit boards and semiconductor package substrates are not simple enough, requiring more complex and time-consuming processes.
Innovation Solution
A photosensitive resin composition containing a base polymer and a compound with an absorption peak at 360 to 500 nm, which emits light upon irradiation, is used to form a patterned resin film that can be inspected using fluorescence intensity measurements at specific wavelengths, allowing for a simpler inspection method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional photosensitive resin compositions are used to form permanent resists, then the resist can be formed with standard properties, but the appearance inspection requires complex and time-consuming processes
Solution Approach 1:
The patent introduces a fluorescent compound into the photosensitive resin composition that causes the cured permanent resist to exhibit strong fluorescence when exposed to ultraviolet light. This color/light change property enables simple visual inspection of the resist appearance without requiring complex equipment or time-consuming processes, directly resolving the contradiction between inspection simplicity and inspection time.
2Productivity
If a photosensitive resin composition with fluorescent compound is used, then the appearance inspection becomes simple and rapid, but the resin composition becomes more complex
Solution Approach 1:
The patent creates a composite photosensitive resin composition by combining a base polymer (such as novolac resin or epoxy resin) with a fluorescent compound. This composite material approach allows the resin to gain the fluorescent property for easy inspection while maintaining the functional properties of the base polymer, thus improving productivity without excessive complexity increase.
Solution Approach 2:
The patent modifies the optical parameters of the resin composition by incorporating a fluorescent compound with specific absorption and emission characteristics. This parameter change enables the resin to fluoresce under ultraviolet irradiation, providing a simple inspection method while the compound is used in controlled amounts to manage composition complexity.
3Measurement precision
If the fluorescent compound is added to enhance inspection capability, then defect detection is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The fluorescent compound serves dual purposes: it provides the inspection capability through fluorescence emission and integrates seamlessly into the existing photosensitive resin formulation process. The compound is incorporated during the standard resin preparation process, requiring no additional manufacturing steps, thus improving defect detection accuracy while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the inspection of permanent resist appearance with a high fluorescence intensity, facilitating early detection of defects and improving production efficiency.
Implementation Method 1
a compound having an absorption peak at 360 to 500 nm and emitting light by light irradiation
Implementation Method 2
a compound having an absorption peak at 360 to 500 nm
Data Source
AI summary
An aspect of the present disclosure relates to a method for forming a permanent resist, the method including a step of coating a photosensitive resin composition, which contains a base polymer and a compound having an absorption peak at 360 to 500 nm and emitting light by light irradiation, to a part or the entire surface of a substrate and drying the photosensitive resin composition to form a resin film, a step of exposing at least a part of the resin film, a step of developing the exposed resin film to form a patterned resin film, and a step of heating the patterned resin film.