Fluorescent Wafer Alignment Marks for Precise Bonding Recognition
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Solution Overview
Problem
The scaling down of semiconductor devices poses challenges in achieving improved quality, yield, performance, and reliability, particularly in the wafer bonding process, due to difficulties in precise alignment and recognition during the manufacturing process.
Innovation Solution
The use of fluorescence material-based alignment marks on both wafers, which are arranged parallel and adjacent to each other, enhances optical recognition and serves as references for each other during bonding, improving the yield and reliability of semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional alignment marks are used during wafer bonding, then the manufacturing process can proceed, but optical recognition is insufficient leading to poor alignment precision
Solution Approach 1:
The patent applies fluorescence materials to alignment marks that exhibit color changes under different excitation wavelengths. The alignment marks fluoresce at wavelengths different from the excitation source, enabling clear optical contrast and precise recognition during wafer bonding alignment processes.
Solution Approach 2:
The patent utilizes the wavelength parameter of light by employing fluorescence materials that convert excitation wavelengths to emission wavelengths. This parameter change enables enhanced optical detection and measurement precision of alignment marks during the bonding process.
2Productivity
If scaling down is continued to meet computing demand, then computing ability increases, but alignment and recognition difficulties increase
Solution Approach 1:
By using fluorescence materials that emit light at different wavelengths than excitation, the alignment marks maintain high visibility and recognition precision even as device dimensions scale down, thereby supporting continued productivity improvement.
Solution Approach 2:
The patent replaces conventional optical reflection-based alignment with fluorescence-based alignment. This substitution provides superior signal-to-noise ratio and detection precision, enabling accurate alignment at scaled dimensions where conventional methods fail.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fluorescence material-based alignment marks improve optical recognition and serve as complementary references during the bonding process, leading to enhanced yield and reliability of semiconductor devices.
Implementation Method 1
The plurality of first alignment marks and the plurality of second alignment marks comprise a fluorescence material
Data Source
AI summary
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a first wafer comprising a first substrate and a plurality of first alignment marks positioned on the first substrate and parallel to each other; and a second wafer positioned on the first wafer and comprising a plurality of second alignment marks positioned above the plurality of first alignment marks. The plurality of second alignment marks are arranged parallel to the plurality of first alignment marks and adjacent to the plurality of first alignment marks in a top-view perspective. The plurality of first alignment marks and the plurality of second alignment marks comprise a fluorescence material.