Fluorescent Substance Wafer Dicing for Chip-Free LED Conversion
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Solution Overview
Problem
The existing methods for manufacturing fluorescent substances for LEDs often result in chipping, cracking, and loss during the dicing process, leading to uneven surfaces and reduced light quality due to the small size and fragile nature of the substances.
Innovation Solution
A method involving forming dicing trenches with inclined sides using a bevel-type dicing blade, followed by secondary cutting with a planar blade, and subsequent surface grinding to remove chipping portions, combined with filling and hardening bonding material within the trenches to secure and separate the substances, ensuring uniform thickness and preventing separation during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a dicing blade is used to directly divide the wafer into small fluorescent substances, then productivity is improved, but chipping and cracking occur on the fluorescent substance surfaces
Solution Approach 1:
The dicing process is segmented into two distinct operations: a first dicing operation that creates initial trenches with spaced-apart blades, and a second dicing operation that completes the division. This segmentation allows each operation to be optimized independently, preventing chipping and cracking while maintaining productivity.
Solution Approach 2:
The first dicing operation performs preliminary cutting to create trenches that define the boundaries of fluorescent substances. Bonding material is then applied to fill these trenches and bond adjacent substances before the second dicing operation completes the division. This preliminary action prepares the structure to withstand the final cutting without damage.
2Volume of moving object
If the wafer is ground to thin the fluorescent substances, then miniaturization is achieved, but the fluorescent substances become fragile and prone to damage
Solution Approach 1:
Bonding material is applied to fill the dicing trenches and bond adjacent fluorescent substances together before the second dicing operation. This bonding creates a cushioning effect that prevents thin, fragile fluorescent substances from chipping or cracking during the final division, even when ground to minimal thickness.
3Productivity
If multiple LEDs are densely arranged to improve productivity, then light output is increased, but light straightness and quality deteriorate due to beam interference
Solution Approach 1:
The bonding material is selectively removed from between the fluorescent substances after bonding has provided structural support during manufacturing. This extraction allows the fluorescent substances to be separated while maintaining their structural integrity, enabling dense LED packaging without compromising light quality or causing beam interference.
4Length of moving object
If the fluorescent substance is made smaller to enable miniaturization, then LED size is reduced, but chipping and cracking phenomena increase
Solution Approach 1:
Bonding material is applied to fill the dicing trenches and bond adjacent fluorescent substances together before the second dicing operation. This bonding creates a cushioning effect that prevents thin, fragile fluorescent substances from chipping or cracking during the final division, even when ground to minimal thickness.
Solution Approach 2:
The dicing process is segmented into two distinct operations: a first dicing operation that creates initial trenches with spaced-apart blades, and a second dicing operation that completes the division. This segmentation allows each operation to be optimized independently, preventing chipping and cracking while maintaining productivity.
Data Source
AI summary
A method of manufacturing a fluorescent substance includes forming dicing trenches on one surface of a fluorescent substance wafer along lattice-shaped dicing lines, and a lower surface grinding operation (S6) of grinding a surface opposite to a surface of the wafer in which the dicing trenches are formed as much as a predetermined thickness using a disk-shaped grinder so that the wafer is divided into a plurality of fluorescent substances, which are color conversion members for light emitting diodes (LEDs).