Fluoride Solvent Composition for Polysiloxane Residue Removal
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Solution Overview
Problem
Current cleaning agents for removing polysiloxane adhesive residue from semiconductor substrates are inefficient and may corrode the substrate, lacking effective solutions for high-temperature stability and rapid residue removal.
Innovation Solution
A cleaning agent composition comprising tetrahydrocarbylammonium fluoride and an organic solvent with an alkylene glycol dialkyl ether and a lactam compound, specifically N-methyl-2-pyrrolidone, which effectively removes polysiloxane adhesive residue without corroding the substrate, ensuring high efficiency and stability at elevated temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional cleaning agents are used to remove polysiloxane adhesive residue, then cleaning is performed, but cleaning efficiency is low and substrate corrosion occurs
Solution Approach 1:
The patent changes the chemical parameters of the cleaning agent by using tetrahydrocarbylammonium fluoride instead of conventional cleaning agents. This chemical parameter change enables rapid removal of polysiloxane adhesive residue while preventing substrate corrosion, thereby improving cleaning speed without causing harmful effects.
Solution Approach 2:
The cleaning agent is formulated as a composite system containing tetrahydrocarbylammonium fluoride combined with specific organic solvents (alkylene glycol dialkyl ether and/or lactam compound). This composite formulation achieves both high cleaning efficiency and substrate protection by synergistic action of the components.
2Speed
If strong cleaning agents are used to remove adhesive residue rapidly, then cleaning speed improves, but substrate corrosion increases
Solution Approach 1:
The patent achieves rapid cleaning without corrosion by changing the chemical nature of the cleaning agent to tetrahydrocarbylammonium fluoride. This substance provides strong cleaning capability through its chemical structure while the specific molecular properties prevent aggressive attack on the substrate, thus achieving high speed cleaning without harmful side effects.
3Strength
If polysiloxane adhesive is used for temporary bonding, then bonding strength is achieved, but adhesive residue removal becomes difficult
Solution Approach 1:
The patent resolves the contradiction between bonding strength and residue removal ease by using tetrahydrocarbylammonium fluoride as the cleaning agent. This chemical effectively breaks down and removes polysiloxane adhesive residue that remains after temporary bonding, making the residue removal process easy while maintaining the bonding strength during the bonding phase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cleaning agent composition achieves rapid and efficient removal of polysiloxane adhesive residue, ensuring high cleaning speed and persistency without substrate corrosion, suitable for various substrates including semiconductor materials.
Implementation Method 1
a cleaning agent composition containing tetrahydrocarbylammonium fluoride and an organic solvent
Implementation Method 2
the organic solvent contains an alkylene glycol dialkyl ether and a lactam compound
Data Source
AI summary
A cleaning agent composition for use in removal of a polysiloxane adhesive remaining on a substrate, the composition containing a tetrahydrocarbylammonium fluoride and an organic solvent, wherein the organic solvent contains an alkylene glycol dialkyl ether and a lactam compound represented by formula (1).(in formula (1), R101 represents a C1 to C6 alkyl group, and R102 represents a C1 to C6 alkylene group.)