Fluorinated Double Cover Layers for Crack-Resistant MLCCs
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with degradation in withstand voltage and reliability due to thinning of dielectric layers for miniaturization, leading to potential cracks from external impacts.
Innovation Solution
Incorporating a higher content of fluorine in the outer regions of the cover portion of the multilayer ceramic capacitor to act as a low-temperature sintering aid, promoting grain growth and densification, thereby enhancing toughness and preventing cracks while maintaining reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the dielectric layer is thinned to implement ultra-miniaturization and ultra-high capacitance, then the size and capacitance performance are improved, but the withstand voltage and reliability properties degrade
Solution Approach 1:
The cover portion is divided into two distinct regions: a first region adjacent to the capacitance formation portion with smaller dielectric grains, and a second region adjacent to the outside with larger dielectric grains. This segmentation allows each region to perform its specific function - the first region provides high density for reliability while the second region provides toughness for crack resistance
Solution Approach 2:
Different regions of the cover portion are given different grain sizes and fluorine contents to optimize local properties. The first region has smaller grains and lower fluorine content for high density and reliability, while the second region has larger grains and higher fluorine content for toughness and crack resistance, resolving the contradiction between reliability and damage resistance
2Reliability
If the size of dielectric grains in the cover portion is reduced to improve density and withstand voltage, then reliability is improved, but the component becomes more susceptible to cracks from external impacts
Solution Approach 1:
The cover portion employs local quality by creating two regions with different grain sizes - smaller grains in the first region for high density and withstand voltage, and larger grains in the second region for toughness and impact resistance. This local differentiation resolves the contradiction between reliability and mechanical strength
Solution Approach 2:
The cover portion functions as a composite structure with two distinct microstructural regions. The combination of fine-grained and coarse-grained areas creates a composite material system that simultaneously achieves high reliability through the fine-grained region and high toughness through the coarse-grained region
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the capacitor's withstand voltage and reliability by controlling grain growth in the inner regions and increasing the toughness of the outer regions, effectively preventing cracks from external impacts.
Implementation Method 1
Incorporating a higher content of fluorine in the outer regions of the cover portion of the multilayer ceramic capacitor to act as a low-temperature sintering aid, promoting grain growth and densification
Data Source
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AI summary
A multilayer electronic component (100) includes a body (110) including a capacitance formation portion (Ac) including a dielectric layer (111) and an internal electrode (121, 122) alternately disposed in a first direction, and a cover portion (112, 113) disposed on both end surfaces of the capacitance formation portion (Ac) opposing each other in the first direction, and an external electrode (131, 132) disposed on the outside of the body (110) and connected to the internal electrode (121, 122). The cover portion (112, 113) has a first region (112a, 113a), adjacent to the capacitance formation portion (Ac), and a second region (112b, 113b), adjacent to the outside of the cover portion. A content of fluorine (F) included in each of the second regions (112b) and (113b) may be greater than a content of fluorine (F) included in each of the first regions (112a) and (113a), respectively. The fluorine (F) included in the second region (112b, 113b) may serves as a low-temperature sintering aid, thereby inducing grain growth and densification of dielectric crystal grains (G2) included in the second region (112b, 113b). Accordingly, the second region (112b, 113b), adjacent to the outside of the cover portion (112) or (113), may have improved toughness to prevent cracks from occurring due to external impacts.