Fluorinated Metal Patterning Material for Heat-Stable Thin Film Deposition
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Solution Overview
Problem
Existing metal patterning materials, such as 1,2-diarylethene derivatives and 1H,1H,2H,2H-perfluorooctyltricholorosilane, face challenges with heat resistance and stability due to low glass transition temperatures, leading to issues with metal adhesion and thermal decomposition during thin film deposition in organic electronic devices.
Innovation Solution
A metal patterning material comprising a compound with an aromatic ring, heteroaromatic ring, and a fluorine atom, specifically designed to have a high glass transition temperature of at least 60°C, which suppresses metal film formation on the film surface and maintains stability under high-temperature conditions, using a compound represented by specific molecular formulas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If 1,2-diarylethene derivative is used as metal patterning material, then metal adhesion is suppressed, but heat resistance deteriorates due to low glass transition temperature
Solution Approach 1:
The patent modifies the molecular structure of the patterning material by incorporating specific aromatic rings (6-15 carbon atoms), fluorine atoms at defined positions (≥10% proportion), and tertiary amine groups. These structural parameter changes result in a glass transition temperature of at least 60°C while maintaining metal adhesion suppression, thus resolving the contradiction between heat resistance and adhesion properties
Solution Approach 2:
The invention creates a composite molecular structure combining aromatic/heteroaromatic rings, fluorine atoms, and tertiary amine groups. This composite structure achieves both high glass transition temperature (≥60°C) and effective metal adhesion suppression, overcoming the limitation of single-component materials with low thermal stability
2Reliability
If material with low glass transition temperature is used, then metal adhesion is suppressed, but thermal stability deteriorates causing liquefaction or crystallization
Solution Approach 1:
The patent changes the physical and chemical parameters of the patterning material by specifying molecular weight (500-3000), glass transition temperature (≥60°C), and fluorine atom proportion (≥10%). These parameter changes ensure thermal stability prevents liquefaction or crystallization while maintaining the metal adhesion suppression function
Solution Approach 2:
The invention replaces unstable, low glass transition temperature materials with stable, high glass transition temperature materials that maintain their properties throughout the device fabrication and operation lifecycle, eliminating the need for replacement or reprocessing due to thermal degradation
3Manufacturing precision
If FTS is used as metal patterning material, then metal pattern formation is achieved, but heat resistance deteriorates due to boiling point in 80°C range
Solution Approach 1:
The patent changes the thermal parameter (glass transition temperature ≥60°C, implying higher operational stability) and molecular structure (aromatic rings with fluorine atoms and tertiary amines) to achieve both precise metal pattern formation and superior heat resistance compared to FTS with boiling point in 80°C range
Solution Approach 2:
The invention introduces fluorine atoms at specific local positions (≥10% proportion of aromatic ring carbons) and tertiary amine groups at specific locations in the molecular structure. These local structural modifications create regions of high thermal stability and controlled metal adhesion, enabling precise patterning with improved heat resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides excellent heat resistance and stability for metal patterning in organic electronic devices, enabling precise metal pattern formation without thermal decomposition, suitable for applications requiring high-temperature stability.
Implementation Method 1
a glass transition temperature is 60° C. or higher
Data Source
AI summary
The present invention provides: a metal patterning material which exhibits excellent heat resistance and is suppressed in the formation of a metal thin film on a film surface; an amine compound; a method for forming a metal pattern using these; and an electronic device. The present invention uses a metal patterning material that contains a compound which comprises, in each molecule, an aromatic ring and/or a heteroaromatic ring, a fluorine atom and at least one tertiary amine, wherein:the aromatic ring is composed of at least one ring selected from the group consisting of a monocyclic aromatic ring, a linked aromatic ring and a fussed aromatic ring having from 6 to 15 carbon atoms;a fused aromatic ring having 16 or more carbon atoms is not contained;the proportion of carbon atoms directly bonded to a fluorine atom among the carbon atoms that form the aromatic ring and the carbon atoms that form the heteroaromatic ring is 10% or more;the molecular weight is from 500 to 3,000; andthe glass transition temperature is 60° C. or higher.