Fluorinated Insulating Layer for Moisture-Resistant MLCC Electrodes
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in achieving miniaturization and high capacitance while maintaining reliability, as the reduction in layer thickness and margin volume increases the risk of moisture and plating solution permeation.
Innovation Solution
The multilayer electronic component features a body with dielectric layers and internal electrodes, external electrodes with specific connection and band portions, an insulating layer made of a fluorine-based organic material, and plating layers on the band portions to prevent moisture and plating solution permeation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the number of laminated layers is decreased by forming internal electrodes and dielectric layers to be thin, then miniaturization and high capacitance are achieved, but the risk of moisture and plating solution permeation increases
Solution Approach 1:
The patent applies a cover layer (insulating layer) made of fluorinated organic material that forms a protective film over the external electrodes and band portions. This thin film barrier prevents moisture and plating solution from permeating into the internal electrodes through the reduced margin thickness, thereby maintaining reliability while enabling miniaturization.
Solution Approach 2:
The patent uses a composite structure combining the ceramic body with internal electrodes, external electrodes, and a fluorinated organic cover layer. This composite material approach creates a multi-functional system where the fluorinated organic material provides enhanced moisture resistance and chemical inertness, protecting the capacitor against permeation despite reduced dimensions.
2Volume of moving object
If the margin thickness is decreased with miniaturization, then mounting space is reduced, but permeation of external moisture or plating solution is facilitated
Solution Approach 1:
The cover layer formed by the fluorinated organic material acts as a protective shell that seals the external electrodes and band portions. This thin film barrier effectively blocks moisture and plating solution permeation paths that would otherwise be facilitated by reduced margin thickness, enabling safe miniaturization.
Solution Approach 2:
The fluorinated organic material creates a chemically inert protective environment around the external electrodes. The fluorinated compound's low polarity and chemical inertness prevent harmful substances like moisture and plating solutions from interacting with or permeating into the internal electrodes, even when margin thickness is reduced for miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances capacitance per unit volume, improves reliability by preventing moisture and plating solution ingress, and reduces mounting space, addressing the challenges of miniaturization and high capacitance.
Implementation Method 1
permeation of external moisture or permation of a plating solution may be facilitated to deteriorate reliability. Accordingly, there is a need for a method of protecting a multilayer ceramic capacitor from permeation of external moisture or permeation of a plating solution.
Data Source
AI summary
A multilayer electronic component includes: a body including dielectric layers and first and second internal electrodes and having first to sixth surfaces; a first external electrode including a first connection portion, disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface; a second external electrode including a second connection portion, disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface; an insulating layer disposed on the second surface and disposed to extend to the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion. The insulating layer includes a fluorine-based organic material.


