Fluorinated Novolak Resin Composition for Transmittance and Mold Release
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Solution Overview
Problem
Existing fluorine-based resins used in electronic device manufacturing do not adequately address the need for high light transmittance, alkali solubility, and reduced adhesiveness to metal molds, which are crucial for efficient production processes.
Innovation Solution
Development of novolak and epoxy resins with a partial structure represented by —C(CF3)H—, incorporating a fluorine atom to enhance light transmittance, alkali solubility, and reduce adhesiveness to metal molds, along with a production method involving reaction with fluoral and epihalohydrin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If fluorine-based resins are used in electronic device manufacturing, then light transmittance is improved, but adhesiveness to metal molds increases
Solution Approach 1:
The patent applies local quality by introducing fluorine atoms at specific positions within the resin molecular structure (using compounds with formulas (1) and (2) where R1-R6 are specific groups). This localized fluorine substitution provides anti-adhesive properties at the mold interface while preserving the overall light transmittance and other functional properties of the resin.
Solution Approach 2:
The patent creates composite material structures by combining fluorinated resin compounds with specific molecular formulas (1) and (2) that contain both fluorine atoms for anti-adhesion and aromatic hydrocarbon structures for light transmittance. This composite molecular architecture achieves multiple contradictory properties simultaneously.
2Illumination intensity
If fluorine-based resins are used in electronic device manufacturing, then light transmittance is improved, but alkali solubility deteriorates
Solution Approach 1:
The patent applies local quality by strategically placing fluorine atoms at specific positions (using compounds with formulas (1) and (2) where R1-R6 are specific groups). This localized fluorine substitution provides light transmittance enhancement while controlling alkali solubility by avoiding excessive fluorine content that would cause hydrophobicity.
Solution Approach 2:
The patent employs parameter changes by precisely controlling the number and position of fluorine atoms in the molecular structure (formulas (1) and (2) with specific R1-R6 groups). This parameter optimization balances light transmittance and alkali solubility by adjusting the fluorine-to-hydrocarbon ratio and molecular architecture.
3Ease of manufacture
If existing fluorine-based resins are used, then manufacturing process is simplified, but patterning performance deteriorates
Solution Approach 1:
The patent applies parameter changes by optimizing the molecular structure parameters (formulas (1) and (2) with specific R1-R6 groups) to achieve balanced properties. The controlled fluorine substitution and molecular weight parameters enable both ease of manufacture and superior patterning performance with high resolution and low line edge roughness.
Solution Approach 2:
The patent creates composite material structures combining fluorinated regions for manufacturing ease with aromatic hydrocarbon regions for patterning precision. This molecular-level composite architecture (formulas (1) and (2)) integrates multiple functional properties that enable both simplified processing and high-resolution patterning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The new resins exhibit improved light transmittance, alkali solubility, and reduced adhesiveness, facilitating better manufacturing processes for electronic devices by enhancing patterning performance and film uniformity.
Implementation Method 1
Development of novolak and epoxy resins with a partial structure represented by —C(CF3)H—, incorporating a fluorine atom to enhance light transmittance, alkali solubility, and reduce adhesiveness to metal molds, along with a production method involving reaction with fluoral and epihalohydrin
Data Source
AI summary
A novolak resin including a partial structure represented by —C(CF3)H—. In addition, there are provided a photosensitive resin composition containing the above-described novolak resin and a photosensitizing agent. In addition, there is provided an epoxy resin having a partial structure represented by —C(CF3)H—. In addition, there is provided a curable resin composition containing the novolak resin or the epoxy resin. In addition, there is provided a cured substance obtained by curing the composition. In addition, there is provided a production method for a novolak resin, including reacting an aromatic compound with fluoral in a presence of an acid catalyst to produce a novolak resin having a partial structure represented by —C(CF3)H—. Further, there is provided a production method for an epoxy resin, including an epoxidation step of reacting a novolak resin having a partial structure represented by —C(CF3)H— with epihalohydrin in a presence of a base.