Fluorinated Olefin Refrigerants for Low-GWP Electronics Cooling
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Solution Overview
Problem
The industry faces a challenge in finding refrigerants with low global warming potential (GWP) that are non-flammable, have acceptable toxicity, and provide effective heat transfer properties, particularly for cooling and heating electronic components, especially in high-performance, compact electronic devices and systems, where traditional fluorinated compounds like Fluorinert™ FC-72 and FC-3284 are undesirable due to high GWP values.
Innovation Solution
The development of novel fluorine-substituted olefins, such as trans-1,3,4,4,5,5-heptafluoro-3-(trifluoromethyl)pent-1-ene and trans-1,4,4,4-tetrafluoro-2,2-bis(trifluoromethyl)but-1-ene, which offer low GWP, non-flammability, and suitable thermal properties for immersion cooling and thermal management of electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional fluorinated compounds (FC-72, FC-3284) are used for cooling electronics, then effective heat transfer and thermal management are achieved, but global warming potential (GWP) becomes unacceptably high
Solution Approach 1:
The patent applies parameter changes by modifying the molecular structure of fluorinated compounds - specifically changing from saturated fluorocarbons to unsaturated fluoroolefins with specific double bond configurations. This structural parameter change results in compounds with lower GWP values while preserving the thermal transfer properties needed for electronics cooling
Solution Approach 2:
The patent employs composite materials by creating fluorinated olefin compounds that combine fluorine substitution patterns with olefin (carbon-carbon double bond) structures. This composite molecular architecture achieves both low environmental impact and effective heat transfer performance
2Temperature
If refrigerant boiling point is lowered below 60°C to achieve better cooling performance, then operating temperature control improves, but dielectric constant increases making immersion cooling problematic
Solution Approach 1:
The patent uses parameter changes by carefully selecting fluorine substitution patterns and olefin configurations to achieve an optimal balance between boiling point and dielectric constant. The specific molecular parameters (fluorine positions, double bond location) are tuned to keep dielectric constant below 4.0 while maintaining boiling point below 60°C
Solution Approach 2:
The patent applies local quality by creating molecules with specific local fluorine arrangements around the olefin group. This localized fluorine substitution pattern optimizes the electronic distribution to achieve desirable dielectric properties while maintaining the thermal properties needed for cooling applications
3Productivity
If electronic devices are made more compact with higher performance, then processing capacity increases, but heat transfer requirements become more stringent
Solution Approach 1:
The patent exploits phase transitions by utilizing the refrigerant's phase change from liquid to vapor and back. The fluoroolefin compounds are designed to undergo efficient phase transitions at temperatures suitable for electronics cooling, absorbing and releasing large amounts of heat energy during these transitions to manage the high heat loads from compact electronic devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These compounds provide efficient heat transfer and thermal management within narrow temperature ranges, ensuring reliable operation and longevity of electronic components while minimizing environmental impact.
Implementation Method 1
The compounds provide efficient heat transfer and thermal management within narrow temperature ranges
Implementation Method 2
transferring heat to and/or from said electronic component, article and/or device
Data Source
AI summary
The compounds trans and cis-1,3,4,4,5,5,5-heptafluoro-3-(trifluoromethyl)pent-1-ene and trans and cis-1,4,4,4-tetrafluoro-3,3-bis(trifluoromethyl)but-1-ene. Methods of heating and/or cooling of electronic components, articles and/or devices during the manufacture and/or operation thereof include providing an electronic component, article or device which is being manufactured and/or being operated for its intended purpose; and transferring heat to and/or from said electronic component, article and/or device during at least a portion of said manufacturing and/or operating process by directly or indirectly transferring heat between said electronic component, article and/or device and a refrigerant fluid comprising at least trans-1,3,4,4,5,5,5-heptafluoro-3-(trifluoromethyl)pent-1-ene or trans-1,4,4,4-tetrafluoro-3,3-bis(trifluoromethyl)but-1-ene.