Resist Composition with Fluorinated Polycyclic Resin for Pattern Resolution
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Solution Overview
Problem
Current resist compositions face challenges in achieving precise pattern formation and dry-etching tolerance due to limitations in acid-labile groups and fluorine-containing compounds, which affect the resolution and adhesiveness of resist patterns.
Innovation Solution
A resist composition incorporating a resin with a structural unit derived from a specific compound (I) and an acid-labile group, combined with an acid generator, to enhance pattern resolution and dry-etching tolerance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional resist compositions are used, then basic pattern formation is achieved, but pattern resolution and dry-etching tolerance are insufficient
Solution Approach 1:
The patent uses a composite resin structure combining polycyclic structures (for adhesion and etching tolerance) with fluorinated groups (for resolution enhancement). This composite approach at the molecular level allows simultaneous achievement of pattern resolution and dry-etching tolerance that cannot be achieved with single-material systems.
Solution Approach 2:
The resist composition employs local quality by incorporating fluorinated groups at specific positions within the resin molecule (as side chains or terminal groups) rather than uniform distribution. This localized fluorination optimizes both resolution and etching tolerance without compromising overall pattern formation capability.
2Manufacturing precision
If acid-labile groups are increased to improve pattern formation, then resolution improves, but adhesion deteriorates
Solution Approach 1:
The patent applies local quality by positioning acid-labile groups specifically within the polycyclic structure at controlled ratios (5-50 mol%), rather than uniform distribution throughout the resin. This localized placement enables precise pattern formation while maintaining adhesion through the remaining polycyclic framework.
Solution Approach 2:
The patent optimizes the ratio of acid-labile groups to total resin structure (5-50 mol%) to achieve the desired balance between resolution and adhesion. This parameter optimization allows the resist to exhibit both high pattern formation precision and sufficient adhesion to the substrate.
3Manufacturing precision
If fluorine-containing compounds are added to enhance resolution, then pattern resolution improves, but dry-etching tolerance deteriorates
Solution Approach 1:
The patent creates a composite molecular structure where fluorinated groups are integrated into the polycyclic resin framework. This composite structure allows the fluorinated portions to enhance resolution while the polycyclic backbone maintains dry-etching tolerance, achieving both benefits simultaneously.
Solution Approach 2:
The patent employs local quality by incorporating fluorinated groups as specific substituents or side chains on the polycyclic structure rather than as the bulk material. This localized fluorination provides resolution enhancement while the main polycyclic structure preserves etching tolerance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition improves pattern resolution and dry-etching tolerance, ensuring better adhesion and precision in resist pattern formation.
Implementation Method 1
exposing the composition layer; heating the exposed composition layer
Implementation Method 2
heating the exposed composition layer
Data Source
AI summary
A compound represented by the formula (I).wherein R1 represents a hydrogen atom, a halogen atom or a C1 to C6 alkyl group that may have a halogen atom; R2 represents a C1 to C12 fluorinated saturated hydrocarbon group; W1 represents a C5 to C18 divalent alicyclic hydrocarbon group; A1 and A2 independently represents a single bond or *-A3-X1-(A4-X2)a—; A3 and A4 independently represents a C1 to C6 alkanediyl group; X1 and X2 independently represents —O—, —CO—O— or —O—CO—; a represents 0 or 1; and * represents a bond to an oxygen atom.