Fluorinated Polyimide Polymers for Low Dielectric Loss
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Solution Overview
Problem
Polyimides used in microelectronics have relatively high dielectric constants and loss factors, limiting their applications, and there is a need for materials with improved dielectric performance, solubility, and low water absorption.
Innovation Solution
Development of a photosensitive polymer composition comprising polyimide-based polymers obtained by polymerizing aromatic carboxylic acid components with specific organic fluorinated diamines, allowing for improved dielectric properties, solubility, and reduced water uptake, suitable for use in printed circuit boards and copper clad laminates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional polyimides are used in microelectronics, then heat resistance and mechanical properties are excellent, but dielectric constant and dielectric loss are relatively high
Solution Approach 1:
The patent changes the chemical composition parameters of polyimides by incorporating fluorinated diamine units with specific molecular structures (formula I) containing CF3 groups and aromatic rings. This chemical parameter modification reduces the dielectric constant to 2.8-3.2 and dielectric loss to 0.003-0.008 at 1 MHz, while preserving the high heat resistance with Tg above 200°C and excellent mechanical properties.
Solution Approach 2:
The patent creates composite polyimide structures by combining fluorinated diamine units (formula I) with various aromatic carboxylic acid components (formula II) including dianhydrides and dicarboxylic acids. This composite approach at the molecular level allows optimization of dielectric properties through the fluorinated units while maintaining thermal stability through the aromatic acid components, achieving both low dielectric loss and high heat resistance simultaneously.
2Loss of energy
If fluorine is introduced to reduce dielectric constant, then dielectric properties are enhanced, but solubility and water absorption characteristics need optimization
Solution Approach 1:
The patent applies local quality by strategically placing fluorinated diamine units (formula I) at specific positions within the polyimide molecular chain, rather than uniform distribution. The fluorinated units with CF3 groups are positioned to optimize dielectric properties while the aromatic carboxylic acid components (formula II) provide solubility control. This localized structural design allows different regions of the polymer to fulfill different functions: fluorinated regions for low dielectric constant and aromatic acid regions for solubility and processability.
3Reliability
If polyimides are used for integrated circuit protection, then reliability is improved, but dielectric loss limits application in advanced microelectronics
Solution Approach 1:
The patent changes the dielectric parameters by incorporating fluorinated diamine units (formula I) that reduce polarizability and dipole moments. The specific molecular structure with CF3 groups and aromatic rings in formula (I) achieves dielectric loss factor of 0.003-0.008 at 1 MHz, making it suitable for advanced microelectronics where low dielectric loss is critical for signal integrity and reduced energy loss in interconnect layers.
Data Source
AI summary
The present invention relates to novel polyimide polymers containing certain fluorinated diamine moieties, said polyimide polymers being characterized by excellent dielectric performances. The present invention also relates to the use of said polyimide-based polymers in polymer compositions in microelectronics applications.