Fluorinated Polymer Coatings for Moisture-Resistant Semiconductor Packages
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Solution Overview
Problem
Conventional inorganic environmental protection layers in semiconductor devices fail to provide adequate protection against moisture ingress in harsh conditions, leading to device failure during high humidity and temperature tests.
Innovation Solution
The use of fluorinated polymers with low dielectric constants and low moisture permeability as conformal coatings or layers on semiconductor devices, including wire bonds, to reduce moisture ingress and dielectric loss, applied through vapor deposition or other processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional inorganic environmental protection layers (oxides or nitrides) are applied via CVD or ALD, then initial environmental protection is provided, but the layers fail under harsh environmental conditions (85% humidity at 130°C for 96 hours or 85% humidity at 85°C for 1000 hours), leading to moisture ingress and device failure
Solution Approach 1:
The patent applies a composite material structure consisting of an inorganic environmental protection layer (oxide or nitride) combined with an organic polymer layer. The inorganic layer provides initial barrier protection, while the organic polymer layer provides enhanced moisture barrier properties under harsh conditions. This composite structure resolves the contradiction by combining the advantages of both material types to achieve both initial protection and sustained reliability in high humidity and temperature environments.
2Object-affected harmful factors
If epoxy encapsulation layers are molded over the package to reduce moisture ingress, then environmental protection is improved, but dielectric loss increases, impacting device performance
Solution Approach 1:
The patent changes the material parameter of the encapsulation layer from conventional epoxy to a fluorinated polymer with specific dielectric properties. The fluorinated polymer has lower dielectric loss compared to epoxy, thereby reducing energy loss while maintaining the moisture barrier function. This parameter change resolves the contradiction by selecting a material that simultaneously provides moisture protection and minimizes dielectric loss for improved device performance.
3Object-affected harmful factors
If thicker encapsulation layers are used to improve moisture barrier properties, then moisture ingress is reduced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent employs a thin film organic polymer layer that provides effective moisture barrier properties without requiring thick encapsulation. The fluorinated polymer forms a conformal thin film coating that effectively blocks moisture ingress while maintaining device simplicity and ease of manufacturing. This thin film approach resolves the contradiction by providing superior moisture protection with reduced layer thickness, thereby simplifying device structure and manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fluorinated polymer layers effectively reduce moisture ingress and associated dielectric loss, enhancing the reliability of semiconductor devices under accelerated stress tests and improving moisture sensitivity levels.
Implementation Method 1
applied through vapor deposition or other processes
Implementation Method 2
fluorinated polymers with low dielectric constants and low moisture permeability
Data Source
AI summary
Semiconductor devices, and more particularly arrangements of fluorinated polymers with low dielectric loss for environmental protection in semiconductor devices are disclosed. Arrangements include conformal coatings or layers of fluorinated polymers that cover a semiconductor die on a package substrate of a semiconductor device. Such fluorinated polymer arrangements may also conformally coat various electrical connections for the semiconductor die, including wire bonds. Fluorinated polymers with low dielectric constants and low moisture permeability may thereby provide reduced moisture ingress in semiconductor devices while also reducing the impact of associated dielectric loss.