Ethylene Oxide Fluorinated Polymer Surfactant for Thin Film Pattern Transfer
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Solution Overview
Problem
The reliability of forming thin film patterns using the reverse resist printing method is compromised due to the reduced transfer characteristic of the etch resist solution, primarily because the adhesive force between the etch resist solution and the blanket is stronger than between the solution and the print plate, leading to inefficient pattern formation.
Innovation Solution
Incorporating an ethylene oxide fluorinated polymer surfactant into the etch resist solution, which enhances the adhesive force between the solution and the print plate while maintaining a weaker bond with the blanket, allowing for improved transfer and pattern reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional surfactants are used in the etch resist solution, then the solution can be sprayed and coated, but the adhesive force between the etch resist solution and the blanket becomes stronger than between the solution and the print plate, causing poor transfer characteristics
Solution Approach 1:
The patent changes the chemical composition parameters of the surfactant by specifying an ethylene oxide fluorinated polymer with a particular molecular structure (CF3(CF2)m(CH2CH2O)n where m=1-10 and n=8-50). This parameter change modifies the adhesive properties of the etch resist solution, making it selectively adhesive to the print plate while reducing adhesion to the blanket, thereby achieving reliable pattern transfer.
Solution Approach 2:
The patent uses a composite surfactant system consisting of an ethylene oxide fluorinated polymer combined with specific base polymers (novolac, PMMA, or PMA) and solvents. This composite material formulation creates a synergistic effect where the fluorinated polymer provides selective adhesion control while the base polymer and solvent ensure proper coating and transfer characteristics.
2Manufacturing precision
If the adhesive force between etch resist solution and blanket is increased for better coating, then the transfer to print plate becomes inefficient because the solution remains stuck on the blanket
Solution Approach 1:
The patent applies local quality by creating differential adhesive properties at different interfaces: the etch resist solution is formulated to have low adhesion to the blanket (first interface) and high adhesion to the print plate (second interface). This is achieved through the ethylene oxide fluorinated polymer surfactant that selectively interacts with the print plate surface, ensuring efficient transfer while maintaining proper coating.
3Manufacturing precision
If photolithography process is used for thin film patterning, then precise patterns can be formed, but the manufacturing cost increases due to multiple processes required
Solution Approach 1:
The patent extracts the essential patterning function from the complex photolithography process and implements it through a simplified reverse resist printing method. By using the specially formulated etch resist solution with ethylene oxide fluorinated polymer surfactant, the process achieves precise pattern formation through direct contact printing, eliminating the need for exposure and development steps while maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of the ethylene oxide fluorinated polymer surfactant ensures a stronger adhesive force with the print plate, facilitating reliable transfer of the etch resist solution and enhancing the overall reliability of the thin film pattern formation process.
Implementation Method 1
the etch resist solution has a surfactant inclusive of an ethylene oxide fluorinated polymer material
Implementation Method 2
enhances the adhesive force between the solution and the print plate
Data Source
AI summary
A fabricating method and apparatus of a thin film pattern improves the reliability of forming the thin film pattern by a resist printing method. The apparatus includes a print roller device of a roll shape around which a blanket is wound; a spray device located around the print roller device for spraying an etch resist solution to the blanket; and a print plate of an engraved shape where a groove of a desired thin film shape and a projected part except the groove are formed, and the etch resist solution has a surfactant inclusive of an ethylene oxide fluorinated polymer material.