Fluorinated Resist Composition for Lithography Resolution and Roughness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional resist materials face challenges in achieving high resolution, sensitivity, and uniformity, particularly as pattern miniaturization advances, with issues such as line edge roughness and in-plane uniformity in lithography techniques for semiconductor and liquid crystal display elements.
Innovation Solution
A resist composition that generates acid upon exposure, incorporating a polymeric compound with specific structural units, such as those represented by general formulas (a0-1) and (a0-2), which changes solubility in developing solutions, enabling improved lithography properties and pattern formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional resist materials are used for pattern miniaturization, then lithography properties such as resolution and sensitivity are improved, but line edge roughness and in-plane uniformity deteriorate
Solution Approach 1:
The patent modifies the chemical structure of the base resin by introducing specific structural units (formula 1) containing fluorinated alkyl groups and acid-decomposable groups. This changes the physical and chemical parameters of the resist material, including solubility characteristics and acid diffusion behavior, thereby improving line edge roughness while maintaining resolution
Solution Approach 2:
The patent creates a composite resist composition by combining the specially designed base resin (with structural units of formula 1) with conventional resist components. This composite approach integrates the benefits of fluorinated groups (for reduced roughness) and acid-decomposable groups (for improved sensitivity and resolution), achieving superior overall lithography properties
2Measurement precision
If conventional resist materials are used for pattern miniaturization, then lithography properties such as resolution and sensitivity are improved, but in-plane uniformity deteriorates
Solution Approach 1:
The patent changes the solubility parameters and glass transition temperature of the base resin through the introduction of fluorinated alkyl groups and acid-decomposable groups. This ensures uniform dissolution behavior across the entire resist film during development, improving in-plane uniformity while maintaining high resolution
3Manufacturing precision
If base resin with cyclic group containing —SO2— structure is used, then mask reproducibility and shape of resist pattern are improved, but solubility control in developing solution becomes challenging
Solution Approach 1:
The patent applies local quality modification by introducing fluorinated alkyl groups at specific positions within the molecular structure of the base resin. This localized modification affects the solubility characteristics of the resin in developing solutions, enabling better control over dissolution rates while maintaining the beneficial shape-forming properties of cyclic groups with —SO2— structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resist composition achieves enhanced resolution, sensitivity, and uniformity, effectively addressing the challenges of miniaturization by forming high-quality resist patterns with improved shape and reduced defects.
Implementation Method 1
an acid generator component that generates acid upon exposure. For example, in the case where the developing solution is an alkali developing solution (alkali developing process), a chemically amplified positive resist which contains, as a base component (base resin), a resin which exhibits increased solubility in an alkali developing solution under action of acid, and an acid generator is typically used. If the resist film formed using the resist composition is selectively exposed during formation of a resist pattern, then within the exposed portions, acid is generated from the acid generator component, and the action of this acid causes an increase in the polarity of the base resin
Data Source
AI summary
A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, including a base component (A) which exhibits changed solubility in a developing solution under action of acid, the base component (A) including a polymeric compound (A1) containing a structural unit (a0) represented by general formula (a0-1) shown below. In the formula, W1 represents a group which is formed by polymerization reaction of a group containing a polymerizable group; Y1 and Y2 each independently represents a divalent linking group; Y3 represents a carbonyl group or an alkylene group; R2 and R3 each independently represents a fluorine atom or a fluorinated alkyl group; Mm+ represents an organic cation having a valency of m; and m represents an integer of 1 or more.