Fluorinated Yttrium Coatings for High-Aspect-Ratio Chamber Surfaces

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Solution Overview

Problem

Existing process chamber components in semiconductor and microelectronic device manufacturing are prone to degradation from reactive process materials, leading to potential contamination and performance issues.

Innovation Solution

A coated substrate with at least two different yttrium oxide coatings, one applied via atomic layer deposition for high aspect ratio surfaces and another via directional deposition for non-high aspect ratio surfaces, followed by fluorination to create a chemically resistant, fluorinated outer surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a single protective coating is applied to all substrate surfaces, then the coating process is simple, but high aspect ratio surfaces cannot be adequately coated by directional deposition methods

Engineering Contradiction:

Improvecoating coverage on high aspect ratio surfacesVSAvoidcoating process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The substrate surface is segmented into two distinct types: high aspect ratio surfaces and non-high aspect ratio surfaces. Each segment receives a specialized coating treatment - directional deposition for accessible surfaces and non-directional deposition for high aspect ratio surfaces - ensuring optimal coating coverage for each surface type while maintaining overall process manageability

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different coating methods are applied to different locations on the substrate based on their geometric characteristics. Non-directional deposition (e.g., ALD) is used specifically for high aspect ratio surfaces where directional methods fail, while directional deposition is used for other surfaces. This local differentiation ensures each surface type receives the most appropriate coating technique

Inventive Principle:

Principle #3Local quality

2Productivity

If reactive process materials are used for semiconductor processing, then effective processing is achieved, but degradation and contamination of process chamber components occurs

Engineering Contradiction:

Improvesemiconductor processing effectivenessVSAvoidprocess chamber component durability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

Protective coatings are applied to process chamber components before they are exposed to reactive process materials. This preliminary protective action prevents degradation and contamination from occurring in the first place, allowing the components to withstand repeated exposure to harsh processing chemicals without losing functionality or generating debris

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The protective coating acts as an intermediary layer between the reactive process materials and the process chamber component substrate. This intermediate barrier allows the reactive materials to perform their semiconductor processing function while preventing direct contact with and damage to the underlying component structure

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The dual-coating approach effectively protects both high aspect ratio and non-high aspect ratio surfaces from reactive chemicals, reducing degradation and contamination, and enhancing the durability and performance of process chamber components.

Implementation Method 1

This coating of the combination may be applied by a non-directional, atomic layer deposition technique

Methodology Applied

Scientific EffectAtomic layer deposition: Chemical Vapour Deposition

Implementation Method 2

This coating, sometimes referred to as a 'partial' coating herein, can be applied to surfaces of a substrate that require a high amount of protection from process chemicals during use of the substrate. The coating may be applied by a directional, 'line-of-sight' deposition method

Methodology Applied

Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Implementation Method 3

Surfaces of one or more of the coatings, after being deposited, may be processed by a fluorination step to be at least partially fluorinated to form yttrium fluoride ('YF3') or fluorinated yttrium oxide ('YOF')

Methodology Applied

Scientific EffectFluorination: Chemical Bonding

Data Source

PatentUS12270104B2Substrate with fluorinated yttrium coatings, and methods of preparing and using the substrates

Publication Date: 2025.04.08 ENTEGRIS INC

AI summary

Described are substrates that include high aspect ratio surfaces and non-high aspect ratio surfaces, at least two coatings, one coating at high aspect ratio surfaces and a second coating at non-high aspect ratio surfaces, and having fluorinated outer surfaces; methods of preparing these coatings; and substrates, surfaces, equipment, and components of equipment that include the coatings.