Fluorine-Treated GaN HEMT Gate Dielectric for Normally-Off Operation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Developing III-V semiconductor compound-based devices, such as high electron mobility transistors (HEMTs), faces challenges in improving transistor performance due to complexities in material configurations and circuit complexity, especially in achieving enhancement-mode operation without a negative-polarity voltage supply.
Innovation Solution
A semiconductor structure is formed with a heterojunction between undoped or unintentionally doped gallium nitride (GaN) and intentionally doped aluminum gallium nitride (AlGaN) layers, creating a two-dimensional electron gas (2-DEG) channel, along with a fluorine-treated gate dielectric layer to achieve an enhancement-mode HEMT with a normally-off carrier channel, reducing circuit complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heterojunction structure with undoped GaN and intentionally doped AlGaN layers is used to create a 2-DEG channel, then electron mobility is enhanced, but the device complexity increases due to multiple material layers and doping configurations
Solution Approach 1:
The semiconductor structure is segmented into distinct functional layers: undoped GaN layer for high electron mobility channel, intentionally doped AlGaN layer for carrier supply, and fluorine-treated gate dielectric layer for threshold voltage control. Each layer performs a specific function, allowing optimization of electron mobility while managing complexity through functional segmentation.
Solution Approach 2:
The invention uses composite material structure combining GaN and AlGaN with different band gaps to form heterojunction. This composite approach enables creation of 2-DEG channel with high electron mobility by exploiting the material properties of both compounds, while the fluorine treatment adds another material dimension for threshold voltage stabilization.
2Device complexity
If enhancement-mode operation is achieved without negative-polarity voltage supply, then circuit complexity is reduced, but manufacturing precision requirements increase due to fluorine treatment and interface control
Solution Approach 1:
Fluorine treatment is performed on the gate dielectric layer before final device assembly and operation. This preliminary action pre-establishes the threshold voltage characteristics and carrier channel properties, allowing the device to achieve enhancement-mode operation without negative voltage supply while simplifying the overall circuit design.
Solution Approach 2:
The fluorine treatment modifies the physical and chemical parameters of the gate dielectric layer, including its dielectric constant and interface properties. This parameter change enables precise control of threshold voltage and carrier concentration, achieving normally-off operation while reducing circuit complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure enhances electron mobility and stability of the threshold voltage, simplifies circuit design by eliminating the need for a negative-polarity voltage supply, and reduces manufacturing costs by avoiding gold in metal features, facilitating integration with silicon-fabrication processes.
Implementation Method 1
A HEMT is a field effect transistor incorporating a junction between two materials with different band gaps (i.e., a heterojunction) as the channel
Implementation Method 2
creating a two-dimensional electron gas (2-DEG) channel
Implementation Method 3
along with a fluorine-treated gate dielectric layer to achieve an enhancement-mode HEMT with a normally-off carrier channel
Data Source
AI summary
A method of forming a semiconductor structure includes growing a second III-V compound layer over a first III-V compound layer, wherein the second III-V compound layer has a different band gap from the first III-V compound layer. The method further includes forming a source feature and a drain feature over the second III-V compound layer. The method further includes forming a gate dielectric layer over the second III-V compound layer, the source feature and the drain feature. The method further includes implanting at least one fluorine-containing compound into a portion of the gate dielectric layer. The method further includes forming a gate electrode over the portion of the gate dielectric layer.


