Fluorine Passivation Film for Display Pad Shorting
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Solution Overview
Problem
In display devices like OLEDs and LCDs, the direct contact between data lines and anode electrodes during the wet etching process leads to galvanic reactions, causing unwanted metal ion contamination and abnormal growth of metal particles, resulting in short circuits and abnormal device driving.
Innovation Solution
A passivation film made of a fluorine-based material is formed on the side walls of the metal pattern layers in the pad area, preventing direct contact and reducing the risk of galvanic reactions by exposing only the necessary parts of the metal pattern layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the protective layer is removed in the pad area to expose the data line for external connection, then the data line can contact the external drive chip, but metal ions from the anode electrode contaminate the data line through galvanic reaction during wet etching
Solution Approach 1:
A passivation film is introduced as an intermediary layer between the data line and the anode electrode in the pad area. This passivation film prevents direct contact between the two metal layers, thereby eliminating the galvanic reaction that causes metal ion contamination, while still allowing the data line to be exposed for external connection purposes
2Ease of operation
If the protective layer is removed to expose the data line, then external circuit connection is enabled, but metal particles on the data line lateral surfaces abnormally grow and cause pad shorting
Solution Approach 1:
The passivation film serves as a protective intermediary that covers the lateral surfaces of the data line in the pad area. This prevents metal particles from abnormally growing on the exposed surfaces, thereby preventing pad shorting while maintaining the external circuit connection capability
3Ease of operation
If the protective layer is completely removed in the pad area, then the data line is fully accessible for connection, but direct contact between data line and anode electrode causes galvanic reaction and metal ion reduction
Solution Approach 1:
The passivation film is selectively applied only in the pad area where the data line is exposed, rather than throughout the entire device. This local application maintains data line accessibility for connection while preventing galvanic reaction and metal ion contamination at the specific location where the anode electrode and data line would otherwise contact
Solution Approach 2:
The passivation film acts as a local intermediary barrier between the data line and anode electrode in the pad area, preventing direct contact and the subsequent galvanic reaction that causes metal ion reduction and contamination
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fluorine-based passivation film effectively prevents metal ion contamination and abnormal growth, ensuring reliable electrical connections and stable device operation by isolating the metal pattern layers and reducing the risk of short circuits.
Implementation Method 1
metal ions contained in the anode electrode are reduced by a galvanic reaction with metal contained in the data line during a wet etching process of forming the anode electrode
Implementation Method 2
when an electric field is generated between pads by a driving power source, metal particles formed on the lateral surfaces of the data lined associated with the pads are abnormally grown
Data Source
AI summary
A display device may include a substrate, an active pattern layer, a gate insulating layer, a first metal pattern layer, an interlayer insulating layer, a second metal pattern layer, and a passivation film. The active pattern layer may be disposed on the substrate. The gate insulating layer may be disposed on the active pattern layer. The first metal pattern layer may be disposed on the gate insulating layer. The interlayer insulating layer may be disposed on the first metal pattern layer. The second metal pattern layer may be disposed on the interlayer insulating layer. The passivation film may be disposed on the side wall of the second metal pattern layer.