Fluorine Polymer Composition Plasma Resistance
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Solution Overview
Problem
There is a need for materials that can provide excellent heat resistance and minimal weight change during semiconductor manufacturing processes involving oxygen and fluorine plasma exposure, as existing solutions do not adequately address the challenges of miniaturization and plasma resistance.
Innovation Solution
A composition containing a fluorine-containing polymer and a hyperbranched polymer of a cage silsesquioxane with a specific structure, which provides excellent heat resistance and a small weight change against oxygen and fluorine plasma exposure, is developed. This composition includes a fluorine-containing elastomer and a hyperbranched polymer of a cage silsesquioxane with a molecular weight distribution of 1-20, acting as a filler to enhance the properties of the molded article.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional fillers (silica, aluminum oxide) are added to fluorine-containing elastomers, then heat resistance and chemical resistance are improved, but weight change during plasma exposure increases and particle generation occurs
Solution Approach 1:
The patent uses a composite filler system combining inorganic fillers (silica, aluminum oxide) with organic fillers (polyimide, polyamide) to achieve synergistic effects. This composite approach allows the material to maintain heat resistance from inorganic fillers while the organic components reduce plasma-induced weight change and particle generation, resolving the contradiction between heat resistance and plasma stability
Solution Approach 2:
The patent optimizes filler particle size parameters, using ultrafine particles (0.1-10 μm) rather than conventional larger particles. This parameter change reduces the surface area exposed to plasma, thereby minimizing weight change and particle generation while maintaining the heat resistance benefits of filler addition
2Reliability
If filler is added to improve sealant characteristics, then chemical resistance and heat resistance are enhanced, but plasma resistance deteriorates and particle generation increases
Solution Approach 1:
The patent employs a composite filler system where inorganic fillers provide chemical resistance and organic fillers (polyimide, polyamide) suppress particle generation during plasma exposure. The synergistic combination allows simultaneous achievement of chemical resistance and reduced plasma-induced particle generation
Solution Approach 2:
The patent applies different filler types in specific combinations tailored for plasma exposure environments. The organic filler components are specifically selected to protect against plasma-induced particle generation at the filler-polymer interface, while inorganic fillers maintain bulk chemical resistance properties
3Temperature
If conventional fillers are used to enhance heat resistance, then thermal stability is improved, but stability against plasma irradiation deteriorates
Solution Approach 1:
The patent creates a composite filler system where inorganic fillers (silica, aluminum oxide) provide heat resistance through high thermal stability, while organic fillers (polyimide, polyamide) contribute plasma resistance by forming stable protective layers during plasma exposure. This composite structure achieves both heat resistance and plasma irradiation stability simultaneously
Solution Approach 2:
The organic filler components act as intermediary protective layers between the inorganic fillers and the plasma environment. These organic fillers absorb plasma energy and protect the inorganic filler-polymer matrix interface, maintaining compositional stability during plasma irradiation while preserving heat resistance properties
Data Source
AI summary
The invention provides a composition capable of providing a molded article that has excellent heat resistance and a small weight change against oxygen plasma exposure and fluorine plasma exposure during a semiconductor manufacturing step. The composition contains a fluorine-containing polymer and a hyperbranched polymer of a cage silsesquioxane with a specific structure.