Fluorine Protection Layer Prevents Oxidation on Semiconductor Connection Terminals
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Solution Overview
Problem
Semiconductor modules face contact failure due to the formation of an oxide layer on exposed connection terminals, which can lead to poor electrical connections and reduced lifespan.
Innovation Solution
A semiconductor package with a protection layer, specifically containing fluorine, is applied to cover the connection terminals and substrates, preventing oxide layer formation and moisture exposure, thereby enhancing reliability and endurance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection terminals are exposed to air, then electrical connection is initially established, but oxide layer forms causing contact failure
Solution Approach 1:
The patent applies preliminary anti-action by forming a protection layer on the connection terminal before it is exposed to air. This protection layer prevents the oxidative reaction from occurring in the first place, rather than trying to remove or prevent it after formation. The protection layer is applied as a preventive measure that counteracts the harmful oxidative effect before it can damage the electrical connection.
Solution Approach 2:
The protection layer serves as an intermediary substance between the connection terminal and the air environment. It mediates the interaction by providing a barrier that prevents direct contact between the terminal surface and oxygen/moisture in the air, thus preventing oxide layer formation while allowing the electrical connection function to proceed.
2Reliability
If protection layer is applied to prevent oxide formation, then reliability is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent applies parameter changes by modifying the surface properties of the connection terminal through the addition of a protection layer. This changes the chemical composition and surface characteristics of the terminal, providing oxidation resistance. The protection layer alters the material parameters of the terminal surface to achieve the desired durability without fundamentally changing the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protection layer effectively prevents oxide layer formation and corrosion, ensuring reliable and long-lasting electrical connections by maintaining the semiconductor package's integrity and performance.
Implementation Method 1
If the connection terminal (e.g., solder) is exposed to the air, an oxide layer may be formed on the connection terminal. A protection layer covering the second surface of the first substrate and the entire second surface of the connection terminal prevents this oxide layer formation.
Implementation Method 2
The protection layer effectively prevents oxide layer formation and corrosion, ensuring reliable and long-lasting electrical connections by maintaining the semiconductor package's integrity and performance.
Data Source
AI summary
A semiconductor package, a semiconductor module, a method of fabricating a semiconductor package are disclosed. The semiconductor package may include a substrate, a semiconductor chip, a connection terminal, a mold layer, and a protection layer. The protection layer may be provided to cover the substrate, the connection terminal, and the mold layer. The protection layer may be removed from a lower portion of the connection terminal, and thus, the lower portion of the connection terminal may be exposed. The connection terminal may be coupled to a module substrate through the lower portion, and a result, the semiconductor module may be fabricated. The connection terminal, the substrate, and the mold layer may be prevented from being exposed to outer air or moisture, owing to the presence of the protection layer.