Fluorine-Containing Resin for High-Temperature ALD Patterning
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Solution Overview
Problem
Conventional atomic layer deposition (ALD) patterning techniques are limited by temperature constraints and have insufficient inhibiting effects, particularly when forming conductive thin films as electrodes or wirings, as they are not effective under high-temperature conditions due to the degradation of materials like PMMA and other polymers.
Innovation Solution
A fluorine-containing resin with a high fluorine content of 30% or more, containing at least one tertiary carbon atom and a quaternary carbon atom, and lacking functional groups, is used as an atomic layer deposition-inhibiting material, allowing for effective film formation even at high temperatures up to 250°C.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional polymers like PMMA are used as atomic layer deposition-inhibiting materials, then patterning can be achieved at low temperatures, but the materials undergo pyrolysis and lose their inhibiting effect at temperatures above 200-250°C
Solution Approach 1:
The patent changes the chemical composition parameters of the resin by incorporating fluorine atoms and specific carbon structures (tertiary and quaternary carbon atoms) while eliminating reactive functional groups. This parameter change enables the material to maintain its inhibiting effect at high temperatures up to 400°C, resolving the contradiction between processing temperature and reliability.
2Reliability
If conventional polymers are used for high-temperature ALD, then temperature constraints are removed, but the inhibiting effect becomes insufficient due to material degradation
Solution Approach 1:
The patent creates a composite molecular structure combining fluorine-containing groups with specific carbon architectures (tertiary and quaternary carbon atoms). This composite structure provides both high-temperature stability and strong ALD inhibiting effect, as the fluorine atoms create a protective barrier while the stable carbon framework prevents degradation at elevated temperatures.
3Temperature
If fluorine-containing resins with high fluorine content are used, then high-temperature resistance is achieved, but the material may still degrade if it contains reactive functional groups
Solution Approach 1:
The patent extracts and eliminates reactive functional groups (carboxyl, hydroxyl, amine groups) from the resin structure, retaining only the stable fluorine-containing backbone with tertiary and quaternary carbon atoms. This extraction of harmful reactive components prevents degradation and maintains fluorine content stability at high temperatures.
Data Source
AI summary
An atomic layer deposition-inhibiting material composed of a fluorine-containing resin that has a fluorine content of 30 at % or greater, has at least one tertiary carbon atom and quaternary carbon atom, and lacks ester groups, hydroxyl groups, carboxyl groups, and imide groups.