Fluorine Solvent Composition with Lewis Acid Boron Additive
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Solution Overview
Problem
The residual amount of fluorine-containing solvents in electronic device films is high due to strong dipole interactions, leading to decreased device performance, particularly when materials with Lewis basicity are used, necessitating a method to reduce solvent residue while maintaining high device performance.
Innovation Solution
A composition comprising a fluorine-containing solvent and a π-conjugated boron compound with low electronegativity and Lewis acidity is used, which traps Lewis bases, reducing solvent residue and enhancing device performance, and is suitable for wet processing methods like inkjet printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a fluorine-containing solvent is used to dissolve the material, then the material solubility is improved, but the solvent residue in the film increases due to strong dipole interactions
Solution Approach 1:
A Lewis base additive is introduced as an intermediary substance that selectively interacts with the fluorine-containing solvent through Lewis acid-base interactions. The additive has a higher affinity for the solvent than the solute does, acting as a mediator to capture the solvent molecules and prevent them from strongly interacting with the solute, thereby reducing solvent residue while maintaining solubility.
Solution Approach 2:
The chemical interaction parameters of the solvent system are changed by adding a Lewis base substance. This additive alters the Lewis acid-base balance of the system, creating new interaction pathways between the solvent and additive that compete with the solvent-solute interactions, thereby modifying the solvent's tendency to remain in the film.
2Productivity
If a fluorine-containing solvent is used, then the wet process efficiency is improved, but the device performance decreases due to residual solvent influence
Solution Approach 1:
The Lewis base additive serves as an intermediary that captures residual fluorine-containing solvent molecules through selective Lewis acid-base interactions. This prevents the residual solvent from interfering with device performance while maintaining the wet process efficiency benefits of using fluorine-containing solvents.
Solution Approach 2:
The harmful residual solvent is converted into a beneficial interaction by introducing the Lewis base additive. The additive exploits the strong dipole interactions and Lewis acidity of the fluorine-containing solvent to form favorable Lewis acid-base complexes, thereby converting the harmful solvent residue into a controlled interaction that actually improves device performance.
3Adaptability or versatility
If materials with Lewis basicity are used, then the material functionality is improved, but the solvent residue increases due to interaction with fluorine-containing solvent
Solution Approach 1:
The Lewis base additive acts as an intermediary that has higher affinity for the fluorine-containing solvent than the Lewis basic material does. This intermediary captures the solvent molecules before they can strongly interact with the functional material, thereby reducing solvent residue while preserving the material's Lewis basicity and functionality.
Solution Approach 2:
The solution creates different interaction zones: the additive preferentially interacts with the solvent in the bulk solution, while the Lewis basic material maintains its functionality in the formed film. This local differentiation of interactions allows the material to retain its Lewis basicity and functionality while the additive handles the solvent interaction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively reduces solvent residue in electronic device films, improving device performance and stability, while allowing for high liquid stability and mass production compatibility.
Implementation Method 1
an electronic device composition containing a specific π-conjugated boron compound having a relatively low electronegativity and a Lewis acidity that traps a Lewis base
Implementation Method 2
a fluorine-containing solvent, and a compound having a structure represented by the following Formula (1)
Data Source
AI summary
The present invention addresses the problem of providing: a composition for electronic devices in which when a film is formed therefrom, the amount of residual solvents including fluorine-containing solvents within the film is reduced, the effects of residual solvents on a device are minimized, and it is thus possible to achieve high element performance; an ink for electronic devices that is suitable for wet processes and that makes it possible to achieve high liquid stability and element performance as a result of containing the composition for electronic devices; and a method for producing an electronic device. This composition for electronic devices contains a component A and a component B and is characterized in that the component A is a fluorine-containing solvent and the component B is a compound having a structure represented by general formula (1).