Fluorocarbon Release Layer for Wafer Separation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Firm adhesion between a semiconductor wafer and a support plate makes it difficult to separate the support plate without damaging the wafer, as strong adhesives can cause damage when the support plate is removed from the wafer with reduced strength.
Innovation Solution
A laminate configuration with a light-transmissive supporting member, a supported substrate, an adhesive layer, and a fluorocarbon release layer that changes properties upon light irradiation, allowing for easy separation of the support plate from the wafer without damaging it.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a strong adhesive is used to firmly adhere the wafer to the support plate, then the adhesion strength is improved, but the ease of separation deteriorates
Solution Approach 1:
The adhesive layer is segmented into multiple functional layers: a first adhesive layer providing strong adhesion between the wafer and support plate, and a second adhesive layer with lower adhesion strength that facilitates separation. This segmentation allows the system to achieve both strong initial adhesion and easy separation by differentiating the adhesive properties of different layers.
Solution Approach 2:
The adhesive layers are designed with different adhesion strength parameters. The first adhesive layer has high adhesion strength to ensure firm bonding during wafer thinning, while the second adhesive layer has lower adhesion strength to enable easy separation. This parameter differentiation resolves the contradiction between strong adhesion and easy separation.
2Length of moving object
If the wafer is thinned to reduce thickness for high integration, then the chip size is reduced, but the strength of the wafer deteriorates
Solution Approach 1:
A support plate is applied to the wafer before the thinning process. This support plate acts as a cushioning layer that compensates for the loss of strength in the thinned wafer, providing mechanical support during handling and processing. The support plate prevents warpage and breakage that would otherwise occur in the thinned wafer.
Solution Approach 2:
The system forms a composite structure combining the thinned wafer with the support plate and multiple adhesive layers. This composite material system allows the thin wafer to maintain structural integrity by leveraging the strength of the support plate and the controlled adhesion properties of the adhesive layers, enabling both thinness and sufficient strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the wafer to be firmly adhered and supported while allowing for easy separation of the support plate, preventing damage to the wafer and facilitating automated handling.
Implementation Method 1
a release layer which is made of a fluorocarbon and is provided between the supporting member and the supported substrate, the release layer having a property that changes when the release layer absorbs light coming through the supporting member
Data Source
AI summary
A laminate including a supporting member which is light transmissive; a supported substrate supported by the supporting member; an adhesive layer provided on a surface of the supported substrate which surface faces toward the supporting member; and a release layer which is made of a fluorocarbon and is provided between the supporting member and the supported substrate, the release layer having a property that changes when it absorbs light coming through the supporting member.