Photosensitive Fluororesin Composition for Organic Semiconductor Substrates

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Solution Overview

Problem

The existing photosensitive resin compositions for organic semiconductor devices have low fluorine atom content in crosslinkable fluororesins, leading to potential damage to the organic semiconductor layer due to the use of aromatic fluorinated solvents, which can degrade the device's performance by reducing carrier mobility.

Innovation Solution

A photosensitive resin composition with a fluororesin having a polymerizable carbon-carbon double bond and a fluorine atom content of at least 47 mass %, combined with a crosslinking agent and a non-aromatic fluorinated solvent, to form a resin film that minimizes damage to the substrate and maintains high solubility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If a photosensitive resin composition containing a crosslinkable fluororesin with low fluorine atom content (about 25 mass %) is used, then the resin can be dissolved in an aromatic fluorinated solvent, but the organic semiconductor layer may be damaged and carrier mobility decreases

Engineering Contradiction:

Improvefluorine atom contentVSAvoiddamage to organic semiconductor layer

Core Design Contradiction:

Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The patent increases the fluorine atom content in the crosslinkable fluororesin from about 25 mass% to at least 47 mass%. This parameter change fundamentally alters the solubility characteristics of the fluororesin, enabling it to be dissolved in non-aromatic fluorinated solvents instead of aromatic fluorinated solvents. The high fluorine content creates strong fluorine-fluorine interactions and enhances the resin's affinity for non-aromatic fluorinated solvents, thereby eliminating the need to use harmful aromatic solvents that damage the organic semiconductor layer and reduce carrier mobility

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent introduces non-aromatic fluorinated solvents as intermediary substances to replace the previously used aromatic fluorinated solvents. These non-aromatic fluorinated solvents serve as a benign mediator that can effectively dissolve the high-fluorine-content fluororesin without causing damage to the organic semiconductor layer. The intermediary solvent bridges the solubility requirements of the fluororesin and the compatibility requirements of the organic semiconductor, enabling the formation of insulating films without harmful effects

Inventive Principle:

Principle #24Intermediary (Mediator)

2Quantity of substance

If an aromatic fluorinated solvent is used to dissolve the fluororesin, then the resin achieves sufficient solubility, but the solubility of organic compounds containing no fluorine is also high, causing damage to the organic semiconductor

Engineering Contradiction:

Improvesolubility of fluororesinVSAvoidperformance of organic semiconductor device

Core Design Contradiction:

Quantity of substanceVSReliability

Solution Approach 1:

The patent changes the chemical structure parameters of the solvent from aromatic fluorinated solvents to non-aromatic fluorinated solvents. This parameter change exploits the specific solubility characteristics of non-aromatic fluorinated solvents, which have high solubility for fluorinated compounds (enabling dissolution of the high-fluorine-content fluororesin) but low solubility for non-fluorinated organic compounds (preventing damage to the organic semiconductor layer). The parameter change creates a selective solubility environment that maintains device reliability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent creates a locally selective solubility environment by using non-aromatic fluorinated solvents that exhibit differentiated solubility behavior: high solubility for fluorinated substances (the resin) and low solubility for non-fluorinated substances (the organic semiconductor). This local quality differentiation allows the solvent to dissolve the resin effectively while leaving the organic semiconductor undamaged, thereby maintaining device performance

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces substrate damage and maintains high solubility, ensuring the organic semiconductor layer's integrity and performance by using a fluororesin with high fluorine content and a non-aromatic solvent, thereby enhancing the device's electrical properties and reliability.

Implementation Method 1

a photosensitive resin composition comprising the following fluororesin (A), the following crosslinking agent (B), a photoinitiator and the following solvent (D)

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS10241404B2Photosensitive resin composition, production method for resin film, production method for organic semiconductor element, and fluorine-containing polymer

Publication Date: 2019.03.26 AGC INC

AI summary

To provide a photosensitive resin composition containing a crosslinkable fluororesin which hardly damages a substrate of e.g. an organic semiconductor when a resin film is formed, and a resin film using it, an organic semiconductor device and its production process, and a fluororesin suitable for the photosensitive resin composition.A photosensitive resin composition comprising a fluororesin having a polymerizable carbon-carbon double bond and having a fluorine atom content of at least 47 mass %, a crosslinking agent having a polymerizable carbon-carbon double bond (excluding the fluororesin), a photoinitiator and a non-aromatic fluorinated solvent.