Fluororesin Surface Modification via Atmospheric Plasma

The patent replaces chemical etching methods with plasma treatment to modify the fluororesin surface. The plasma treatment introduces polar groups and roughens the surface to improve adhesion without causing discoloration, thus substituting a chemical process with a physical one that avoids the harmful side effects.

The patent changes the surface energy parameters of the fluororesin by controlling plasma treatment conditions (power, time, gas type) to achieve optimal adhesion. By adjusting these parameters, the surface is modified to be more adhesive while maintaining the base material's appearance and properties.

The patent applies plasma treatment for a limited duration and at controlled power levels to achieve sufficient surface modification without over-treatment. This partial action approach provides adequate adhesion improvement while minimizing treatment time and energy consumption, avoiding the need for excessive treatment.

The patent optimizes plasma treatment parameters (power density, treatment time, gas flow rate) to achieve the minimum effective treatment duration. By carefully controlling these parameters, the process achieves good adhesion with reduced treatment time compared to conventional plasma treatments.

The patent utilizes the phase transition region of the fluororesin by heating the surface to near the melting point during plasma treatment. This temporary phase change enhances molecular mobility and facilitates peroxide radical formation and crosslinking, improving surface hardness. The treatment is controlled to prevent actual melting or degradation.

The patent employs controlled heating before plasma treatment to prepare the surface at an optimal temperature range. This preliminary thermal preparation ensures that when plasma is applied, the surface is receptive to peroxide radical formation without exceeding degradation temperatures, thus cushioning against potential material damage.