Fluororesin Template Coating for Planar Imprint Release

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Solution Overview

Problem

Existing planarization techniques for semiconductor substrates, such as chemical mechanical polishing (CMP) and imprint methods, face challenges in achieving high planarity and mold releasability, particularly with soft materials, leading to damage and poor productivity.

Innovation Solution

A molding apparatus and template with a planarization coating layer made of fluorine resin, such as CYTOP, to reduce mold releasing force and ensure high planarity, using a template with an SFQR of 20 nm or less, enabling mass productivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a template with high planarity is used to ensure substrate flatness, then manufacturing precision is improved, but mold releasing force increases causing substrate damage

Engineering Contradiction:
Improvesubstrate planarityVSAvoidsubstrate damage during release
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

A release layer is introduced as an intermediary between the template and the curable composition. This release layer has low surface energy that reduces adhesion to the curable composition, allowing easy mold release without damaging the substrate while maintaining the template's high planarity for achieving SFQR of 20 nm or less

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The surface energy parameter of the template is modified by adding a release layer with specifically controlled surface energy characteristics. This parameter change reduces the adhesion force between template and curable composition, enabling easy release while preserving the template's planar surface quality

Inventive Principle:
Principle #35Parameter changes

2Manufacturing precision

If chemical mechanical polishing is used to planarize soft materials, then surface flatness is improved, but process complexity and cost increase

Engineering Contradiction:
Improvesurface flatnessVSAvoidprocess control complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The mechanical CMP process is replaced with a photolithography-based imprint method. A template with a planar contact surface is brought into contact with the curable composition on the substrate, and UV light is applied to cure the composition. This transfers the template's planarity to the substrate without requiring complex CMP process control

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The approach changes from mechanical removal of material (CMP) to optical curing of a planarized layer. By controlling the template's contact surface planarity and curing the curable composition under it, the substrate achieves the required SFQR without complex mechanical polishing parameters

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If uniform planarization is applied to substrates with surface unevenness, then process simplicity is maintained, but manufacturing precision deteriorates

Engineering Contradiction:
Improveprocess uniformityVSAvoidsubstrate planarity
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The template's planar contact surface provides localized planarity exactly where needed - in the contact region between template and substrate. This local planarization through direct contact achieves the required SFQR without requiring uniform planarization of the entire substrate surface

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves high planarity and stable mold release, allowing for efficient formation of planar surfaces on substrates with reduced damage and improved productivity.

Implementation Method 1

a planarization coating layer which has a site front least squares range (SFQR) of 20 nm or less in a contact surface... made of fluorine resin, such as CYTOP

Methodology Applied
Scientific EffectLow surface energy: Surface Tension

Implementation Method 2

a planarization coating layer of which a site front least squares range (SFQR) is 20 nm or less in a contact surface

Methodology Applied
Scientific EffectSurface planarity control:

Implementation Method 3

irradiating UV light, thereby curing the curable composition

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS12436456B2Molding apparatus, molding method, and template
Publication Date: 2025.10.07 CANON KK
  • US12436456B2 patent drawing
  • US12436456B2 patent drawing
  • US12436456B2 patent drawing

AI summary

A molding apparatus including a template apparatus is configured to bring the template into contact with a curable composition arranged on a substrate and to cure the curable composition. The template includes a planarization coating layer of which a site front least squares range (SFQR) is 20 nm or less in a contact surface which is a surface of the template in contact with the curable composition.