Fluororesin Template Coating for Planar Imprint Release
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Solution Overview
Problem
Existing planarization techniques for semiconductor substrates, such as chemical mechanical polishing (CMP) and imprint methods, face challenges in achieving high planarity and mold releasability, particularly with soft materials, leading to damage and poor productivity.
Innovation Solution
A molding apparatus and template with a planarization coating layer made of fluorine resin, such as CYTOP, to reduce mold releasing force and ensure high planarity, using a template with an SFQR of 20 nm or less, enabling mass productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a template with high planarity is used to ensure substrate flatness, then manufacturing precision is improved, but mold releasing force increases causing substrate damage
Solution Approach 1:
A release layer is introduced as an intermediary between the template and the curable composition. This release layer has low surface energy that reduces adhesion to the curable composition, allowing easy mold release without damaging the substrate while maintaining the template's high planarity for achieving SFQR of 20 nm or less
Solution Approach 2:
The surface energy parameter of the template is modified by adding a release layer with specifically controlled surface energy characteristics. This parameter change reduces the adhesion force between template and curable composition, enabling easy release while preserving the template's planar surface quality
2Manufacturing precision
If chemical mechanical polishing is used to planarize soft materials, then surface flatness is improved, but process complexity and cost increase
Solution Approach 1:
The mechanical CMP process is replaced with a photolithography-based imprint method. A template with a planar contact surface is brought into contact with the curable composition on the substrate, and UV light is applied to cure the composition. This transfers the template's planarity to the substrate without requiring complex CMP process control
Solution Approach 2:
The approach changes from mechanical removal of material (CMP) to optical curing of a planarized layer. By controlling the template's contact surface planarity and curing the curable composition under it, the substrate achieves the required SFQR without complex mechanical polishing parameters
3Ease of manufacture
If uniform planarization is applied to substrates with surface unevenness, then process simplicity is maintained, but manufacturing precision deteriorates
Solution Approach 1:
The template's planar contact surface provides localized planarity exactly where needed - in the contact region between template and substrate. This local planarization through direct contact achieves the required SFQR without requiring uniform planarization of the entire substrate surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high planarity and stable mold release, allowing for efficient formation of planar surfaces on substrates with reduced damage and improved productivity.
Implementation Method 1
a planarization coating layer which has a site front least squares range (SFQR) of 20 nm or less in a contact surface... made of fluorine resin, such as CYTOP
Implementation Method 2
a planarization coating layer of which a site front least squares range (SFQR) is 20 nm or less in a contact surface
Implementation Method 3
irradiating UV light, thereby curing the curable composition
Data Source
AI summary
A molding apparatus including a template apparatus is configured to bring the template into contact with a curable composition arranged on a substrate and to cure the curable composition. The template includes a planarization coating layer of which a site front least squares range (SFQR) is 20 nm or less in a contact surface which is a surface of the template in contact with the curable composition.


