Fluorosilicon Release Layer for Thin Display Substrate Handling

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Solution Overview

Problem

The production of display devices, such as LCDs, LEDs, and OLEDs, faces challenges due to the fragile nature of thin substrates and the high precision and harsh conditions required during manufacturing processes, leading to issues with substrate handling and alignment.

Innovation Solution

A method involving a display device substrate secured to a carrier substrate with an adhesive delamination layer and a release layer, where the release layer is a cured product of a precursor composition containing at least one fluorosilicon compound, facilitating better substrate handling and processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional release layers are used to handle thin display device substrates, then substrate handling is possible, but the substrates are still fragile and prone to damage during manufacturing processes

Engineering Contradiction:

Improvesubstrate handling reliabilityVSAvoidsubstrate damage risk

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies parameter changes by modifying the chemical composition of the release layer to include fluorosilicon compounds (such as fluorosilanes, fluorosiloxanes, or fluorinated silicon resins). This chemical parameter change provides enhanced protection to thin substrates during handling and processing, reducing substrate damage risk while maintaining handling reliability

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs composite materials by combining fluorosilicon compounds with other release layer components to create a multi-functional release layer. This composite structure provides both the protective function needed to prevent substrate damage and the release function needed for subsequent processing steps

Inventive Principle:

Principle #40Composite materials

2Manufacturing precision

If precise alignment is required during manufacturing processes, then manufacturing precision is improved, but the complexity of handling thin substrates increases

Engineering Contradiction:

Improvesubstrate alignment precisionVSAvoidsubstrate handling complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent uses the release layer as an intermediary between the substrate and the manufacturing environment. This intermediary provides a controlled interface that simplifies substrate handling while enabling precise alignment during manufacturing processes, reducing the overall handling complexity

Inventive Principle:

Principle #24Intermediary (Mediator)

3Stability of the object's composition

If strong adhesion is used to secure substrates during processing, then substrate stability is improved, but removal from carrier substrate requires high peeling forces

Engineering Contradiction:

Improvesubstrate processing stabilityVSAvoidpeeling force

Core Design Contradiction:

Stability of the object's compositionVSForce

Solution Approach 1:

The patent applies local quality by creating different adhesion characteristics in different layers: the adhesive delamination layer provides strong adhesion to the carrier substrate for processing stability, while the release layer provides controlled, lower adhesion to the display device substrate for easy removal with reduced peeling forces

Inventive Principle:

Principle #3Local quality

4Length of moving object

If thin substrates are used to reduce device thickness, then device miniaturization is achieved, but substrate fragility increases

Engineering Contradiction:

Improvedevice thicknessVSAvoidsubstrate durability

Core Design Contradiction:

Length of moving objectVSReliability

Solution Approach 1:

The patent applies beforehand cushioning by positioning the release layer between the adhesive delamination layer and the thin display device substrate. This release layer acts as a protective cushion that absorbs mechanical stresses and prevents substrate damage during handling and processing, enabling the use of thinner substrates without compromising durability

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances the handling and processing of display device substrates by improving their stability and alignment during manufacturing, reducing the risk of damage and misalignment, and allowing for easier removal from the carrier substrate with lower peeling forces.

Implementation Method 1

The release layer includes a cured product of curing a precursor release layer composition. The precursor release layer composition is curable and includes at least one fluorosilicon compound.

Methodology Applied

Scientific EffectFluorosilicon compound effect:

Data Source

PatentUS10800947B2Release layer including at least one fluorosilicon compound

Publication Date: 2020.10.13 DOW SILICONES CORP

AI summary

Various embodiments disclosed related to a release layer including at least one fluorosilicon compound, and to related aspects such as methods for display device substrate processing. In various embodiments is a method of processing a display device substrate. The method can include securing the display device substrate to a carrier substrate with an adhesive delamination layer and a release layer between the adhesive delamination layer and the display device substrate. The release layer includes a cured product of a precursor release layer composition. The precursor release layer composition includes at least one fluorosilicon compound.