Flush Antenna Layer Semiconductor Package for Thin PoP Integration
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Solution Overview
Problem
The challenge in the electronics industry is to achieve high integration and multiple functions with high performance while minimizing the manufacturing cost, particularly in semiconductor packages, where miniaturization is critical to reduce size and power consumption, especially for 3D graphic processing circuits in mobile devices.
Innovation Solution
A semiconductor package design that includes a first substrate, a first and second layer structure, and an antenna layer, where the antenna layer is formed on one of the layer structures and flush with its upper surface, and an electronic component is disposed on the substrate's lower surface, with the layer structures being encapsulated by molding compounds to reduce thickness and enhance integration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple packages are integrated in a single semiconductor package (PoP structure), then the size is reduced and integration density is increased, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent implements Package-on-Package (PoP) structure where a second package is stacked vertically on top of a first package, creating a nested three-dimensional configuration. This nesting approach achieves high-density integration and size reduction by utilizing vertical space rather than horizontal expansion, while maintaining separate package functionalities within a compact footprint.
Solution Approach 2:
The patent transitions from traditional two-dimensional package arrangement to three-dimensional stacking by positioning the second package vertically above the first package. This dimensional change enables higher integration density and reduced overall package footprint, addressing the size reduction requirement while managing the complexity through structured vertical integration.
2Adaptability or versatility
If the antenna layer is formed on the layer structure, then the wireless communication function is added, but the package thickness increases
Solution Approach 1:
The patent integrates the antenna layer directly onto the existing layer structure of the semiconductor package, merging the wireless communication functionality with the package substrate. This integration approach adds RF capabilities while minimizing thickness increase by utilizing the existing package layers rather than adding separate antenna structures.
Solution Approach 2:
The layer structure serves multiple functions: it provides mechanical support for the package, enables electrical connections, and hosts the antenna layer for wireless communication. This multi-functionality reduces the need for additional dedicated structures, thereby controlling package thickness while adding versatility.
3Power
If 3D graphic processing circuit is integrated, then the performance is improved, but the power consumption increases
Solution Approach 1:
The patent divides the semiconductor package into multiple separate packages (first package and second package), each handling specific processing functions. This segmentation allows for optimized power management where the 3D graphic processing circuit can be isolated and powered selectively, improving performance while controlling overall power consumption through modular architecture.
Data Source
AI summary
A semiconductor package includes a first substrate, a first layer structure, a second layer structure, a first antenna layer and an electronic component. The first antenna layer is formed on at least one of the first layer structure and the second layer structure, wherein the first antenna layer has an upper surface flush with a layer upper surface of the first layer structure or the second layer structure. The electronic component is disposed on a substrate lower surface of the first substrate and exposed from the first substrate. The first layer structure is formed between the first substrate and the second layer structure.