Flush Protective Case Structure for Airtight LED Packaging
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Solution Overview
Problem
Existing semiconductor light emitting devices face challenges in protection from dust and moisture, and there is a need for a cost-effective and reliable method to enhance the bonding strength and airtightness of protective cases while allowing efficient light transmission.
Innovation Solution
A protective case design featuring a protective cover with a transparent plate, where the cover and plate are flush at their interfaces to improve adhesion and airtightness, and can be made from materials like glass, resin, or metal, with a manufacturing method involving integrally molding and dicing to reduce costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a protective cover is used to protect the semiconductor light emitting device, then protection from dust and moisture is improved, but bonding strength and airtightness at the interface may be insufficient
Solution Approach 1:
The patent applies local quality by creating a recess portion at the interface between the protective cover and transparent plate, where the depth varies locally to optimize both bonding strength and airtightness. The recess allows adhesive to pool and create a mechanical interlock, while the varying depth provides different bonding characteristics in different regions of the interface.
Solution Approach 2:
The patent introduces an adhesive as an intermediary substance that fills the recess portion between the protective cover and transparent plate. This adhesive mediator enhances the bonding strength by creating a chemical and mechanical connection, while also improving airtightness by sealing the interface gap.
2Illumination intensity
If a protective cover with opening is used, then light transmission is enabled, but protection effectiveness may be reduced
Solution Approach 1:
The patent resolves this contradiction by transitioning from a two-dimensional planar interface to a three-dimensional recess structure. The recess portion extends in the depth dimension, allowing the adhesive to create a mechanical interlock that maintains protection effectiveness while the opening in the protective cover allows light transmission.
3Ease of manufacture
If conventional manufacturing methods are used, then production is simpler, but manufacturing cost and productivity may be insufficient
Solution Approach 1:
The patent merges the protective cover and transparent plate manufacturing into a single integrated process using injection molding. The recess portion is formed directly during molding, eliminating the need for separate machining or forming operations. This combining of steps improves both manufacturing simplicity and productivity.
Solution Approach 2:
The patent utilizes parameter changes in the injection molding process to create the recess portion with specific depth and geometry. By controlling molding parameters such as injection pressure, temperature, and cavity design, the recess is formed directly during manufacturing, enabling high-volume production with consistent quality.
Data Source
AI summary
A protective case includes a protective cover and a transparent plate. A first bottom surface of the protective cover is provided with a bottom opening. A front surface of the protective cover is provided with a front opening. The front opening of the protective cover extends to the first bottom surface of the protective cover. A transparent plate is attached to the front surface of the protective cover to close the front opening. The first bottom surface of the protective cover and the second bottom surface of the transparent plate are flush with each other.