Flush Cooling Chip Heat Dissipation Structure for Mobile Devices

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Solution Overview

Problem

Mobile devices with slim designs and closed internal spaces face challenges in efficiently dissipating heat produced by high-power computing units due to limited air convection and reduced size of passive heat dissipation elements, leading to heat accumulation and performance issues.

Innovation Solution

A heat dissipation structure featuring an element holding member with a cooling chip and heat dissipation elements, such as a copper thin sheet or vapor chamber, where the cooling chip's cold and hot surfaces are flush with the holding portion's sides, allowing for efficient heat transfer and dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If passive heat dissipation elements (heat spreader, vapor chamber, heat sink) are mounted in mobile devices, then heat dissipation is assisted, but the elements must be extremely thin due to limited internal space, resulting in reduced heat transfer efficiency and poor heat dissipation performance

Engineering Contradiction:

Improveheat dissipation performanceVSAvoidinternal space

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The heat dissipation system is divided into multiple functional layers: a cooling chip layer for active heat removal, a heat spreader layer for heat distribution, and a heat sink layer for heat dissipation. This segmentation allows each layer to be optimized independently, achieving effective heat dissipation within limited space.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs a nested structure where the cooling chip is integrated with the heat spreader, which is in turn integrated with the heat sink. This multi-layer nested arrangement maximizes heat dissipation efficiency within the constrained internal volume of the mobile device.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Length of moving object

If the mobile device has a slim body design, then portability is improved, but the internal space for heat dissipation is reduced, causing heat accumulation

Engineering Contradiction:

Improveoverall thicknessVSAvoidheat accumulation

Core Design Contradiction:

Length of moving objectVSTemperature

Solution Approach 1:

The cooling chip is strategically positioned directly over the high-power computing units to provide localized active cooling where heat generation is most intense. This local quality approach ensures effective heat removal from critical areas without increasing overall device thickness.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The cooling chip acts as an intermediary between the heat-generating computing units and the passive heat dissipation elements (heat spreader and heat sink). It actively transfers heat from the computing units to the passive elements, enabling effective heat dissipation in the slim device structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If the mobile device has a closed internal space to prevent foreign matter and moisture invasion, then device protection is improved, but air convection for heat dissipation is blocked

Engineering Contradiction:

Improveprotection from foreign matters and moistureVSAvoidheat dissipation efficiency

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent replaces the mechanical convection system (air flow through open holes) with a thermally conductive solid-state heat dissipation system consisting of the cooling chip, heat spreader, and heat sink. This substitution maintains device sealing while achieving effective heat removal through thermal conduction.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This structure enhances heat dissipation performance by effectively transferring heat away from electronic elements, preventing accumulation and improving the overall cooling efficiency of mobile devices, even under high-power computing conditions.

Implementation Method 1

The cooling chip has a cold surface and an opposite hot surface. The cooling chip is set on the holding portion with the cold surface and the hot surface being flush with the first side and the second side of the holding portion, respectively

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

heat dissipation elements, such as a copper thin sheet or vapor chamber

Methodology Applied

Scientific EffectPhase change: Phase Change

Data Source

PatentUS10114430B2Heat dissipation structure for mobile device

Publication Date: 2018.10.30 ASIA VITAL COMPONENTS CO LTD

AI summary

A heat dissipation structure for mobile device includes an element holding member, which has a holding portion and a cooling chip set on the holding portion. The holding portion has a first side and an opposite second side; and the cooling chip has a cold surface and an opposite hot surface. The cooling chip is set on the holding portion with the cold surface and the hot surface being flush with the first and the second side of the holding portion, respectively. The heat dissipation structure can be mounted in a mobile device to quickly cool heat-producing electronic elements in the mobile device, so that any produced heat is guided away from the mobile device without accumulating therein.