Flush Metal Layer Wiring Substrate for LED Mounting Stability
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Solution Overview
Problem
In recent light emitting devices, the miniaturization of light emitting elements and the formation of reflective layers for efficient light usage lead to interference issues between the reflective layer and the fine light emitting elements, making stable mounting challenging.
Innovation Solution
A wiring substrate design featuring a heat sink, an insulating member, and a wiring pattern with a metal layer where the metal layer's surface is flush with the insulating member, preventing interference between the reflective layer and the light emitting element, and allowing for efficient light reflection and mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a reflective layer is formed on the element mounting surface to efficiently use light, then light reflection efficiency is improved, but the reflective layer interferes with and contacts the fine light emitting element, making stable mounting difficult
Solution Approach 1:
The patent introduces a wiring pattern structure that acts as an intermediary between the reflective layer and the light emitting element. The wiring pattern includes a first surface and a second surface opposite to the first surface, with the second surface contacting the insulating member. A metal layer is formed on the first surface of the wiring pattern, and the surface of the metal layer is flush with the exposed surface of the insulating member. This wiring pattern structure separates the reflective layer from the light emitting element, preventing direct contact and interference while maintaining stable mounting of the light emitting element.
2Productivity
If light emitting elements are miniaturized to achieve high density mounting, then mounting density is improved, but the gap between the light emitting element and wiring layers is narrowed, increasing interference risk
Solution Approach 1:
The wiring pattern structure serves as a mediator that enables high density mounting of miniaturized light emitting elements while preventing interference. By providing a structured interface with the metal layer surface flush with the insulating member exposed surface, it maintains adequate separation even as elements are miniaturized, thus preserving mounting stability despite increased density.
Solution Approach 2:
The patent applies local quality by providing specific structural features at the interface between the wiring pattern and insulating member. The metal layer is positioned such that its surface is flush with the exposed surface of the insulating member, creating a locally optimized structure that prevents interference while accommodating miniaturized elements for high density mounting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses interference between the reflective layer and the light emitting element, enabling stable mounting of miniaturized elements while reducing light loss and improving heat dissipation performance.
Implementation Method 1
a heat sink
Implementation Method 2
a reflective layer having high reflectance is formed on an element mounting surface
Data Source
AI summary
There is provided a wiring substrate. The wiring substrate includes: a heat sink; an insulating member on the heat sink; a wiring pattern embedded in the insulating member and including a first surface and a second surface opposite to the first surface, the second surface contacting the insulating member; and a metal layer on the first surface of the wiring pattern, wherein an exposed surface of the metal layer is flush with an exposed surface of the insulating member.