Flush-Mounted Device Cooling Plate Thermal Bridge Design

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Solution Overview

Problem

Existing electronic flush-mounted devices for building installation technology face challenges in effectively dissipating heat from heat-generating components, particularly in well-insulated environments where traditional heat dissipation methods are limited.

Innovation Solution

The design incorporates a cooling plate with a special spring geometry that makes thermally conductive contact with heat-generating components and a support ring, using spring clips to guide heat-dissipating outer surfaces through housing openings to the exterior, enhancing heat dissipation despite a small housing size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a traditional heat dissipation method is used in a small housing, then the device structure remains simple, but the heat dissipation efficiency is insufficient

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidhousing size
Core Design Contradiction:
TemperatureVSVolume of stationary object

Solution Approach 1:

The cooling plate extends heat dissipation from the internal three-dimensional space to the external two-dimensional surface by guiding outer surfaces through housing openings. This dimensional transition allows heat to be dissipated to the exterior environment, effectively increasing the heat dissipation area beyond the limited housing volume.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The cooling plate is divided into multiple functional zones: spring clips for component contact, springy tabs for support ring contact, and guided outer surfaces for external heat dissipation. This segmentation allows each part to specialize in a specific heat transfer function, optimizing overall thermal management efficiency.

Inventive Principle:
Principle #1Segmentation

2Reliability

If the housing is well-insulated to protect internal components, then component protection is improved, but heat dissipation capability deteriorates

Engineering Contradiction:
Improvecomponent protectionVSAvoidheat dissipation capability
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The housing system is segmented into two functional zones: the main housing provides insulation and protection for internal components, while the cooling plate with external extensions provides a dedicated heat dissipation pathway. This segmentation allows simultaneous achievement of component protection and effective heat dissipation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The cooling plate acts as an intermediary between the insulated housing interior and the external environment. It thermally couples heat-generating components to the support ring while guiding outer surfaces to the exterior, creating a controlled thermal bridge that enables heat dissipation without compromising the insulating integrity of the main housing.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Temperature

If a cooling plate with spring clips is added to improve heat dissipation, then heat dissipation performance increases, but device complexity increases

Engineering Contradiction:
Improveheat dissipation performanceVSAvoiddevice structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The cooling plate integrates multiple functions into a single component: it provides thermal contact with heat-generating components via spring clips, creates thermal coupling with the support ring via springy tabs, and extends heat dissipation surfaces to the exterior through guided outer surfaces. This multi-functionality reduces the need for separate heat dissipation components, thereby limiting the increase in device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution ensures reliable heat loss dissipation, increasing the performance of the flush-mounted device by creating a thermal bridge from the components to the support ring and ultimately to the exterior, even in well-insulated installations.

Implementation Method 1

a cooling plate (16) for dissipating the heat loss from the inside of the housing to the outside of the housing

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

which has at least one spring clip (17) on at least one main surface for the thermally conductive contact with at least one heat-generating component

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 3

springy tabs are formed on the cooling plate, which press on the support ring of the flush-mounted insert. This creates a thermal bridge to the support ring

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentEP2793337B1Electronic flush mounted device for building installation technology
Publication Date: 2018.01.31 ABB AG(DE)
  • EP2793337B1 patent drawingFigure 1~2
  • EP2793337B1 patent drawingFigure 3~4
  • EP2793337B1 patent drawingFigure 5~6

AI summary

An electronic flush-mounted device for building installation technology is proposed, comprising a flush-mounted insert, a mounting ring, and an operating element as its main components. Inside the housing of the flush-mounted insert, a printed circuit board assembly with at least one heat-generating component and a cooling plate for dissipating heat loss from the inside of the housing to the outside are provided. The insert is bent into a rectangular shape, forming up to four main surfaces parallel to the housing walls. At least one main surface has at least one spring-loaded clamping tab for thermally conductive contact with at least one heat-generating component. At least one main surface has spring-loaded tabs for thermally conductive contact with the mounting ring. At least two main surfaces have heat-dissipating outer surfaces that are guided from the inside of the housing to the outside of the housing via housing openings.