Flush Optoelectronic Package Structure for Slim Photo Interrupters

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Solution Overview

Problem

Conventional photo-interrupters used in electronic devices, such as gaming mice, face challenges in achieving a small and slim design due to their larger size and optical path, which affects speed and accuracy, and are prone to dust and dirt accumulation on protruded lenses.

Innovation Solution

An optoelectronic package structure with a housing encapsulating lead frames and an optoelectronic element, where the sealing element is flush with the housing surface, reducing the overall size and optical path, and incorporating a reflector cup to enhance light emission and reception efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If protruded lenses are used on light-emitting and light-receiving elements, then light emission and reception efficiency is improved, but overall device size and optical path length increase

Engineering Contradiction:
Improvelight emission and reception efficiencyVSAvoidoverall device size
Core Design Contradiction:
Illumination intensityVSVolume of moving object

Solution Approach 1:

The patent merges the light-emitting element and light-receiving element into a single integrated package structure, with both elements disposed on the same lead frame. This integration eliminates the need for separate housing for each element and allows the sealing element to flush with the housing surface, reducing overall size while maintaining optical efficiency through optimized internal light paths.

Inventive Principle:
Principle #5Merging (Combining)

2Illumination intensity

If protruded lenses are used on light-emitting and light-receiving elements, then light emission and reception efficiency is improved, but the device becomes prone to dust and dirt accumulation

Engineering Contradiction:
Improvelight emission and reception efficiencyVSAvoiddust and dirt accumulation
Core Design Contradiction:
Illumination intensityVSObject-affected harmful factors

Solution Approach 1:

The patent merges the light-emitting element and light-receiving element into a single integrated package structure, with both elements disposed on the same lead frame. This integration eliminates the need for separate housing for each element and allows the sealing element to flush with the housing surface, reducing overall size while maintaining optical efficiency through optimized internal light paths.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If conventional photo-interrupter structure is used, then light emission and reception function is achieved, but optical path length is too long affecting response speed

Engineering Contradiction:
Improvelight emission and reception functionVSAvoidresponse speed
Core Design Contradiction:
ReliabilityVSSpeed

Solution Approach 1:

The patent transitions from a conventional linear optical path arrangement to a three-dimensional integrated package structure. By disposing both light-emitting and light-receiving elements on the same lead frame with vertical stacking and optimized spatial arrangement, the optical path is shortened in the horizontal dimension while maintaining functional reliability through proper optical coupling.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Reliability

If light-emitting and light-receiving elements are oppositely disposed in separate housings, then optical function is achieved, but device complexity and size increase

Engineering Contradiction:
Improveoptical functionVSAvoidstructural complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the light-emitting element and light-receiving element into a single integrated package structure, with both elements disposed on the same lead frame. This integration eliminates the need for separate housing for each element and allows the sealing element to flush with the housing surface, reducing overall size while maintaining optical efficiency through optimized internal light paths.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces the size and optical path of the photo-interrupting device, enhances light emission and reception efficiency, and minimizes dust interference, improving response speed and accuracy.

Implementation Method 1

the optoelectronic element is configured to emit light or receive light

Methodology Applied
Scientific EffectLight emission: Light Emitting Diode

Implementation Method 2

the optoelectronic element is configured to emit light or receive light

Methodology Applied
Scientific EffectLight reception: Photoelectric Effect

Implementation Method 3

incorporating a reflector cup to enhance light emission and reception efficiency

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS12401005B2Optoelectronic package structure and photo-interrupting device
Publication Date: 2025.08.26 LITE ON TECH CORP
  • US12401005B2 patent drawing
  • US12401005B2 patent drawing
  • US12401005B2 patent drawing

AI summary

An optoelectronic package structure and a photo-interrupting device are provided. The photo-interrupting device includes a casing and two optoelectronic package structures oppositely arranged. The optoelectronic package structure includes a housing, a first lead frame, a second lead frame, an optoelectronic element, and a sealing element. The optoelectronic element is disposed on the first lead frame and is electrically connected to the second lead frame through a conducting wire. The housing encapsulates one part of each of the first lead frame and the second lead frame. Another part of each of the first lead frame and the second lead frame correspondingly protrudes from one end of the housing having an opening arranged on a first surface, and the optoelectronic element is exposed through the opening. The sealing element covers the optoelectronic element, and a surface of the sealing element is not higher than the first surface of the housing.