Flux Coating Line for Uniform Solder Coverage Without Dies
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Solution Overview
Problem
Existing liquid coating devices struggle to maintain uniform flux application on long, thin solder surfaces over time, requiring frequent replacement of adjustment dies and leading to inconsistent coatings.
Innovation Solution
A liquid coating device with a dipping mechanism, conveying system, load application, drying, and cooling mechanisms, along with a control system that measures and regulates conveying speed to ensure consistent flux application, eliminating the need for special members and reducing maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a die is used to adjust the amount of flux applied to the solder line, then the flux application amount can be controlled, but the die becomes clogged with solidified flux over time making it difficult to maintain uniform thickness
Solution Approach 1:
The invention removes the problematic die component entirely from the flux application system. Instead of using a die to control flux amount, the patent uses a dip tank with controlled immersion depth and a pulling mechanism that draws the solder line through the flux at a regulated speed, eliminating the clogging issue inherent in die-based systems
Solution Approach 2:
The invention transitions from a static die-based flux application system to a dynamic system where the solder line is continuously pulled through the flux at a controlled speed. The flux application amount is regulated by the pulling speed and dip depth rather than a fixed die opening, allowing continuous operation without clogging
2Adaptability or versatility
If the thickness of flux to be applied is changed, then different application requirements can be met, but the die must be replaced which increases complexity and maintenance
Solution Approach 1:
The invention changes the control parameter from die opening size to pulling speed and immersion depth. By adjusting the speed at which the solder line is pulled through the flux and the depth of immersion in the dip tank, different flux application thicknesses can be achieved without physical replacement of components
Solution Approach 2:
The dip tank and pulling mechanism serve multiple functions: they both apply the flux and control the application thickness simultaneously. This universal system replaces the need for multiple specialized dies, simplifying the overall device structure while maintaining versatility
3Productivity
If the solder line is pulled through a die to apply flux, then the flux can be applied before soldering, but the system cannot maintain uniform application over long periods without maintenance
Solution Approach 1:
The invention enables continuous flux application operation by eliminating the die component that requires periodic replacement. The pulling mechanism and dip tank system can operate continuously without interruption for maintenance, maintaining uniform flux application over extended production periods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves uniform flux coating on solder surfaces, reducing production costs and maintaining reliability over extended use by controlling conveying speed and temperature, ensuring consistent thickness and stability.
Implementation Method 1
a drying means that dries the object on which the liquid is applied
Implementation Method 2
a cooling means that cools the dried object
Implementation Method 3
a discharging means that is communicated to an outside of the chamber and discharges hot air within the chamber to the outside of the chamber
Data Source
Figure 1
Figure 2A~2C
Figure 3A~3B
AI summary
In the flux applying device 100, a control portion 5 controls conveying rollers 11, 41-44 and 66 or the like so that thickness of flux 3 applied to solder 9a is controlled. The winding roller 66 rotates so that the solder 9 is conveyed at the conveying speed. The drawing-out roller 11 applies any load (back tension) to the solder 9a backward along the conveying direction of the solder 9a when drawing out the solder 9a. The solder 9a is conveyed at the predetermined speed and dipped into the flux tank 30 containing flux 3. The solder 9a is pulled up from the flux tank 30 at the conveying speed vertically. By pulling up the solder 9a from the flux tank 30 at the constant conveying speed vertically, the interfacial tension acts on the solder 9a and the flux 3, so that the flux 3 having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder 9a.