Micro Fluxgate Sensor Viahole Electroplating
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Solution Overview
Problem
Conventional methods for manufacturing micro fluxgate sensors face challenges in achieving reliable electrical connections between coils due to the small size of viaholes, leading to defects and reduced sensitivity in magnetic field detection.
Innovation Solution
A method involving the formation of metal patterns with lower and upper coil portions, application of electrical signals for electroplating viaholes, and subsequent insulation layers to ensure effective connection and isolation, allowing for improved electrical characteristics and reduced defect rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the viahole size is reduced to improve manufacturing precision, then the electrical connection reliability deteriorates
Solution Approach 1:
The patent applies preliminary action by forming a seed layer in the viaholes before electroplating the metal material. This seed layer serves as a foundation that ensures reliable electrical connection between the lower and upper coils, preventing connection failures that would occur with simply filling small viaholes with metal material.
Solution Approach 2:
The patent changes the physical and chemical parameters of the viahole filling process by using electroplating instead of simple filling. The electroplating process controls the metal deposition through electrical parameters (current density, plating time), ensuring complete and reliable filling of small viaholes while maintaining manufacturing precision.
2Reliability
If the viahole size is increased to improve electrical connection, then the manufacturing precision deteriorates
Solution Approach 1:
The patent uses electroplating parameters (current density, plating time, electrolyte composition) to control the metal deposition process. This allows precise control over the metal filling even in small viaholes, maintaining manufacturing precision while ensuring reliable electrical connection through complete filling.
3Productivity
If the metal material filling is performed without proper seed layer to improve productivity, then the electrical connection reliability deteriorates
Solution Approach 1:
The patent performs the preliminary action of forming a seed layer before electroplating. Although this adds a step to the process, it ensures reliable electrical connection by providing a proper foundation for metal deposition, preventing connection failures that would require rework and actually improve overall manufacturing efficiency.
4Weight of stationary object
If the core size is reduced to make the sensor thinner and lighter, then the flux leakage increases
Solution Approach 1:
The patent uses thin film magnetic material layers to construct the core. These thin films provide effective magnetic flux confinement despite the reduced core size, preventing flux leakage while maintaining the sensor's thin and light characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the electrical connection between coils, stabilizes coil resistance, reduces defects, and improves the overall sensitivity and reliability of the micro fluxgate sensor.
Implementation Method 1
applying an electrical signal through the metal pattern and plating the viaholes with a metal material to form a connection portion
Data Source
AI summary
A method of manufacturing a micro flux gate sensor that has a good electrical connection and can be easily manufactured includes operations of forming a metal pattern, forming a first insulation layer to cover the metal pattern and forming viaholes to expose a certain portion of the metal pattern, applying an electrical signal through the metal pattern and plating the viaholes with a metal material to form a connection portion, forming a magnetic core on an upper portion of the first insulation layer, forming a second insulation layer to cover the magnetic core and forming an upper coil portion electrically connected to the connection portion to form the excitation coil and the magnetic field detecting coil, forming a third insulation layer to cover the upper coil portion, and removing a certain portion of the metal pattern to leave only the lower coil portion of the metal pattern.