Flying Tail Rigid-Flexible PCB Uncured Insulator Filling
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Solution Overview
Problem
Conventional methods for manufacturing flying tail type rigid-flexible printed circuit boards are costly due to the need for etching processes and curing of insulators, which also affect the filling properties and manufacturing efficiency.
Innovation Solution
The method involves using a base substrate with a first insulating layer made of a rigid insulator and a second insulating layer made of a flexible insulator, eliminating the need for etching and curing by processing cavities on the flexible domain and using uncured prepreg for improved filling properties and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods using cured insulators and etching processes are used, then manufacturing precision and structural integrity are improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent changes the physical state parameter of the insulator from cured (rigid) to uncured (flexible) form. The uncured insulator material is applied in a flexible state that allows conformal coating over the 3D structured circuit board, then cured in place to achieve the desired structural integrity, eliminating the need for separate etching processes
Solution Approach 2:
The patent extracts and eliminates the etching process from the manufacturing sequence by using a flexible uncured insulator that can be conformally applied and cured directly, removing the harmful etching step while maintaining manufacturing precision
2Manufacturing precision
If etching processes are used to remove insulator material, then circuit pattern precision is improved, but manufacturing time and process complexity increase
Solution Approach 1:
Instead of applying insulator material and then removing excess through etching, the patent inverts the approach by using a flexible uncured insulator that is conformally applied to match the exact circuit pattern shape, then cured to lock in the precise pattern without requiring subsequent removal processes
3Stability of the object's composition
If cured insulators are used to provide mechanical strength, then structural stability is improved, but flexibility and filling properties deteriorate
Solution Approach 1:
The patent utilizes the parameter change of the insulator material from uncured (flexible) to cured (rigid) state. During application, the material remains in uncured flexible state to conform to the 3D structure and provide good filling properties, then is cured in place to achieve the required structural stability, combining both flexibility and stability benefits
Data Source
AI summary
The present invention relates to a method of manufacturing a flying tail type rigid-flexible printed circuit board and a flying tail type rigid-flexible printed circuit board manufactured by the same and implement a flying tail type rigid-flexible printed circuit board with improved filling property by providing a method of manufacturing a flying tail type rigid-flexible printed circuit board including: providing a base substrate having a first inner circuit pattern layer on both surfaces; laminating a first insulating layer on a rigid domain R of the base substrate; laminating at least one circuit layer, which extends over the entire domain of the base substrate, on the first insulating layer; and removing a portion of the circuit layer, which corresponds to a flexible domain F, wherein the circuit layer includes a second insulating layer and a flying tail type rigid-flexible printed circuit board manufactured by the same.