Flyover Cable Connector Layout for High-Density PCB Surface Contacts

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Solution Overview

Problem

Existing electrical connectors face performance limitations in supporting higher data rates due to signal integrity issues and limited scalability for multi-conductor cables connecting to arrays of surface contacts on printed circuit boards.

Innovation Solution

The design incorporates a connector body with parallel passageways and cable terminators that provide a 'flyover' configuration, allowing multi-conductor cables to be spaced further apart from surface contacts, reducing signal transitions and enabling greater channel counts and contact density, with coplanar contact surfaces for improved signal integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If multi-conductor cables are connected directly to surface contacts on PCB, then connection simplicity is improved, but signal integrity deteriorates due to signal transitions and interference

Engineering Contradiction:
Improveconnection simplicityVSAvoidsignal integrity
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent introduces an edge connector as an intermediary component between the multi-conductor cables and the surface contacts on the PCB. The connector body with its interior volume and passageways provides a mediating structure that allows cables to be routed through without direct contact with the PCB surface contacts, thereby reducing signal transitions while maintaining connection functionality.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent transitions from a two-dimensional surface connection approach to a three-dimensional volumetric approach by creating an interior volume within the connector body. This allows cables to pass through the volume via passageways rather than making surface-level connections, reducing electromagnetic interference and signal transitions while maintaining electrical connectivity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Quantity of substance

If cable spacing is reduced to increase contact density, then channel count increases, but signal interference worsens

Engineering Contradiction:
Improvecontact densityVSAvoidsignal interference
Core Design Contradiction:
Quantity of substanceVSObject-affected harmful factors

Solution Approach 1:

The patent implements a nested structure where multiple passageways are contained within the connector body's interior volume. Each passageway is nested within the overall connector structure, allowing multiple cables to be routed through closely spaced passageways while the enclosing structure provides shielding and maintains proper spacing between individual cable paths, thus increasing contact density without proportionally increasing interference.

Inventive Principle:
Principle #7Nested doll (Nesting)

Data Source

PatentUS11916324B2Connecting multi-conductor cables with surface contacts
Publication Date: 2024.02.27 CISCO TECHNOLOGY INC
  • US11916324B2 patent drawing
  • US11916324B2 patent drawing
  • US11916324B2 patent drawing

AI summary

An electrical connector for connecting to an array of surface contacts includes a connector body and a plurality of cable terminators. The connector body defines an interior volume and includes an external surface defining a plurality of cable openings each configured to receive a respective multi-conductor cable therethrough and a plurality of passageways. The plurality of cable terminators are each configured to couple with a respective multi-conductor cable exiting the second section of a respective passageway. Each cable terminator includes a plurality of pins each configured to couple with a respective conductor of the multi-conductor cable and to extend to a respective contact surface. The contact surfaces of the plurality of cable terminators extend to a second plane. The first plane and the second plane are coplanar when the array is in the connection position.