Foamed Inorganic Thermal Composition for High-Temperature Dissipation
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Solution Overview
Problem
Current thermally-conductive compositions used in electronic devices face limitations in high-temperature stability, heat dissipation efficiency, and environmental safety, as they often degrade at temperatures above 300°C and contain harmful organic substances, restricting device miniaturization and reliability.
Innovation Solution
A thermally-conductive composition comprising foamed inorganic powders such as boron nitride, silicon carbide, and aluminum oxide, combined with a silicate glass solution and isopropyl alcohol binder, which provides improved heat conductance and dissipation properties up to 1000°C, while being non-toxic and environmentally friendly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If organic binder-based thermally-conductive compositions are used, then ease of manufacture is improved, but high-temperature stability deteriorates as they oxidize at 300-600°C
Solution Approach 1:
The patent changes the chemical composition parameters by replacing organic binders with inorganic binders (alumina, silica, magnesia) and using inorganic fillers instead of organic particles. This fundamental material parameter change enables the composition to withstand temperatures above 600°C without oxidation, while maintaining manufacturability through slurry-based processing methods.
Solution Approach 2:
The patent creates a composite material system combining inorganic binders (alumina, silica, magnesia) with inorganic fillers (alumina, silica, magnesia, boron nitride) in a slurry matrix. This composite approach leverages the high-temperature stability of inorganic materials while maintaining workability through the liquid slurry vehicle, resolving the contradiction between ease of manufacture and high-temperature stability.
2Loss of energy
If cooling fans or metal heat dissipation structures are embedded in devices, then heat dissipation performance is improved, but device complexity and weight increase
Solution Approach 1:
The patent merges the heat dissipation function directly into the existing composition material that fills spaces between electronic components. Instead of adding separate cooling fans or metal heat sinks, the thermally-conductive composition itself becomes the heat dissipation medium, combining structural filling and thermal management functions into a single integrated solution.
Solution Approach 2:
The thermally-conductive composition serves multiple functions simultaneously: it acts as a space-filling material between components, provides thermal conduction pathways for heat dissipation, offers oxidation protection, and maintains electrical insulation. This multi-functionality eliminates the need for separate dedicated heat dissipation structures, reducing device complexity.
3Ease of manufacture
If organic binder-based compositions are used, then ease of manufacture is improved, but environmental safety deteriorates due to harmful organic substances
Solution Approach 1:
The patent changes the chemical composition from organic-based to inorganic-based materials. By using inorganic binders (alumina, silica, magnesia) and inorganic fillers instead of organic substances, the composition eliminates harmful volatile organic compounds and toxic additives while maintaining the slurry-based ease of manufacture and application processes.
Solution Approach 2:
The patent converts the traditional reliance on organic binders (which provide ease of manufacture but cause environmental harm) into an inorganic binder system that maintains workability through alternative mechanisms. The inorganic slurry system achieves similar application ease without the harmful environmental effects, effectively converting a harmful approach into a beneficial one.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enhances heat dissipation and conductance in electronic devices, maintaining stability and safety at high temperatures, reducing harmfulness to the human body, and enabling more efficient heat management in various applications.
Implementation Method 1
A thermally-conductive composition comprising foamed inorganic powders such as boron nitride, silicon carbide, and aluminum oxide, combined with a silicate glass solution and isopropyl alcohol binder, which provides improved heat conductance and dissipation properties up to 1000°C
Implementation Method 2
foamed inorganic thermally-conductive powders... improved endothermic, exothermic, and heat dissipation properties at high temperatures above about 1000° C.
Implementation Method 3
a binder comprising a silicate glass solution and isopropyl alcohol... maintaining stability and safety at high temperatures
Data Source
AI summary
In a first aspect of the present disclosure, there is provided a thermally-conductive composition comprising: a functional agent comprising at least one of boron nitride (BN), silicon carbide (SiC), aluminum oxide (Al2O3), and aluminum nitride (AlN), and foamed inorganic thermally-conductive powders; and a binder comprising a silicate glass solution and isopropyl alcohol. The thermally-conductive composition may have improved endothermic, exothermic, and heat dissipation properties at high temperatures above about 1000° C. Further, the device using the thermally-conductive composition may have improved heat conductance and heat dissipation. Furthermore, the thermally-conductive composition may have reduced harmfulness to the human body.