Focus Ring Buffer Module for Faster Vacuum Transfer
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Solution Overview
Problem
The existing substrate treating apparatuses face inefficiencies in replacing focus rings, leading to increased time and reduced accuracy in transporting substrates, due to complex and error-prone sequences during the replacement process.
Innovation Solution
The apparatus incorporates a buffer module with a support shelf and drive member to move the ring member between a buffer space and a load-lock chamber, simplifying the transport sequence by reducing the number of steps and improving alignment accuracy through alignment pins, and utilizing a controller to coordinate the movement and pressure control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the focus ring is replaced through multiple steps involving atmospheric pressure chamber, load-lock chamber, and vacuum chamber, then the ring member can be transported from atmospheric pressure to vacuum environment, but the transport sequence becomes very complicated and time-consuming
Solution Approach 1:
The apparatus is divided into distinct functional modules: atmospheric pressure chamber for loading ring members, load-lock chamber for pressure transition, vacuum chamber for substrate treatment, and buffer chamber for temporary storage. Each module handles a specific aspect of the transport process, simplifying the overall system control and reducing transport sequence complexity while maintaining reliability
Solution Approach 2:
The load-lock chamber serves as an intermediary chamber between the atmospheric pressure environment and the vacuum environment. It enables pressure transition without requiring direct connection between atmospheric and vacuum chambers, simplifying the transport sequence by providing a dedicated intermediate step that can be independently controlled
2Reliability
If the focus ring is replaced through multiple steps, then the pressure transition from atmospheric to vacuum is achieved, but the time spent replacing the focus ring is increased
Solution Approach 1:
Ring members are pre-loaded into the atmospheric pressure chamber before the vacuum chamber is evacuated. This preliminary loading action allows the vacuum chamber to be prepared independently, and when ring replacement is needed, the new ring member is already in position and can be transferred quickly once the load-lock chamber pressure is equalized
Solution Approach 2:
The buffer chamber maintains a ready supply of ring members in the vacuum environment. When the focus ring needs replacement, a new ring member can be immediately transferred from the buffer chamber through the load-lock chamber to the vacuum chamber without interrupting the substrate treatment process, ensuring continuous operation
3Ease of operation
If the focus ring is replaced through several steps, then the ring member can be properly positioned, but the accuracy in transporting the focus ring is deteriorated
Solution Approach 1:
The support shelf is designed with self-alignment features including guide rails and positioning pins that automatically align the ring member with the transfer port during the transfer process. This self-alignment mechanism reduces the need for complex manual positioning operations while maintaining high transport accuracy
Solution Approach 2:
The load-lock chamber is designed to equalize pressure between the atmospheric pressure chamber and the vacuum chamber during the transfer process. By creating an intermediate pressure state that is equipotential between the two environments, the system enables smooth transition of the ring member without pressure differentials that could affect positioning accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the efficiency of substrate treatment by reducing the complexity of the transport sequence, improving the accuracy of ring member transport, and increasing the number of substrates that can be treated per hour.
Implementation Method 1
a drive member that moves the support shelf
Implementation Method 2
The plasma is generated by heating a neutral gas to a very high temperature or subjecting the neutral gas to a strong electric field or an RF electromagnetic field
Implementation Method 3
Plasma refers to an ionized gaseous state of matter containing ions, radicals, and electrons
Implementation Method 4
The etching process is performed by collision or reaction of ions and/or radicals contained in the plasma with the thin film on the substrate
Implementation Method 5
a load-lock chamber 15, the inside of which is switched between an atmospheric pressure atmosphere and a vacuum atmosphere
Data Source
AI summary
An apparatus for treating a substrate includes a process chamber that treats the substrate, a buffer module that accommodates a ring member to be transported into the process chamber, and a load-lock chamber having an inner space. The buffer module includes a buffer chamber having a buffer space in which the ring member is accommodated, a support shelf that supports the ring member in the buffer space, and a drive member that moves the support shelf.