Focus Ring Geometry for Uniform Heat Transfer Gas Discharge

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Solution Overview

Problem

Existing substrate processing technologies face challenges in achieving uniform discharge of heat transfer gas, accurate installation of focus rings, and efficient control of plasma, leading to reduced yield in etching processes.

Innovation Solution

A focus ring design with specific geometric features, including inclined surfaces and parallel orientations, facilitates uniform gas discharge and precise positioning, enhancing the substrate processing apparatus's efficiency and yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional focus ring design is used, then the structure is simple, but the gas discharge is non-uniform and installation is inaccurate

Engineering Contradiction:
Improveinstallation accuracyVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The focus ring incorporates different surface geometries (flat surface and inclined surface) at specific locations to achieve uniform gas discharge. The inclined surface is positioned where gas discharge is needed, while other areas maintain different characteristics, creating local quality variations that solve the uniform discharge problem without complicating the entire structure.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The bottom surface of the focus ring features an asymmetric design with both flat and inclined portions. This asymmetric geometry creates specific gas flow paths that enable uniform gas discharge between the focus ring and the stage, while the asymmetric shape also provides positioning features for accurate installation.

Inventive Principle:
Principle #4Asymmetry

2Temperature

If heat transfer gas is supplied to control focus ring temperature, then temperature control is achieved, but gas discharge uniformity is poor

Engineering Contradiction:
Improvefocus ring temperature controlVSAvoidgas discharge uniformity
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The bottom surface of the focus ring is designed with different geometries (flat and inclined surfaces) at different locations. The inclined surface creates a specific gap geometry that enhances gas discharge uniformity in the region where temperature control is most critical, while maintaining overall temperature control functionality.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The invention introduces a dimensional variation by creating an inclined surface that forms a wedge-shaped gap between the focus ring and the stage. This angular geometry adds a spatial dimension to the gas flow path, enabling more uniform gas distribution across the focus ring bottom surface while maintaining temperature control.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Productivity

If the focus ring installation process is simplified, then installation time is reduced, but positioning accuracy decreases

Engineering Contradiction:
Improveinstallation speedVSAvoidpositioning accuracy
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The focus ring's bottom surface geometry (combination of flat and inclined surfaces) enables self-positioning during installation. When the focus ring is placed on the stage, the inclined surface automatically aligns with the corresponding stage features, creating self-centering and self-positioning effects that ensure accurate placement without requiring complex alignment procedures or additional positioning mechanisms.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The focus ring ensures accurate and prompt installation, uniform gas distribution, and improved etching process yield by controlling heat transfer gas discharge, thereby optimizing substrate processing.

Implementation Method 1

The bottom surface includes: a flat surface perpendicular to the first direction; and an inclined surface that extends from the flat surface toward the second inner lateral surface, the inclined surface making a second acute angle with the first direction

Methodology Applied
Scientific EffectGas flow control through inclined surface geometry:

Implementation Method 2

To control a temperature of the focus ring, a heat transfer gas may be supplied toward a bottom surface of the focus ring

Methodology Applied
Scientific EffectHeat transfer through gas convection and conduction: Convection

Data Source

PatentUS12555754B2Focus ring, substrate processing apparatus including the same, and substrate processing method using the same
Publication Date: 2026.02.17 SAMSUNG ELECTRONICS CO LTD
  • US12555754B2 patent drawing
  • US12555754B2 patent drawing
  • US12555754B2 patent drawing

AI summary

Focus rings, substrate processing apparatuses, and substrate processing methods are provided. A focus ring includes a ring body having an axis that extends in a first direction. The ring body includes a top surface, an inner lateral surface that downwardly extends from the top surface, and a bottom surface that outwardly extends from a lower end of the inner lateral surface. The inner lateral surface includes a first inner lateral surface that downwardly extends from the top surface, and a second inner lateral surface that downwardly extends from a lower end of the first inner lateral surface. The second inner lateral surface forms a first acute angle with the first direction. The bottom surface includes a flat surface, and an inclined surface that extends from the flat surface toward the second inner lateral surface. The inclined surface forms a second acute angle with the first direction.