Semiconductor Focus Ring Heating via Selective Light Absorption

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Solution Overview

Problem

Existing semiconductor manufacturing apparatuses face challenges in heating components within the processing chamber without inducing abnormal electric discharges and require costly redesigns for induction heating, which increases manufacturing costs.

Innovation Solution

A method and apparatus that utilize heating lights with specific wavelength bands capable of passing through one material and being absorbed by another within the processing chamber, allowing for efficient heating of components without the need for induction heating units or coils, using a configuration with a quartz top plate, silicon focus ring, and ceramic or diamond-like carbon parts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If an induction heating unit is installed within the focus ring and an induction coil is installed in the processing chamber, then the focus ring can be heated by magnetic field, but the apparatus complexity increases and manufacturing costs increase

Engineering Contradiction:
Improvefocus ring temperatureVSAvoidapparatus complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent replaces the induction heating system (electromagnetic field-based heating) with a resistance heating system (electrical current-based heating). Instead of using an induction coil to generate magnetic fields for heating the focus ring, the patent uses a resistance heater that directly converts electrical energy to thermal energy through the focus ring's electrical resistance, thereby simplifying the apparatus structure

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent extracts and removes the induction coil from the processing chamber, eliminating the source of abnormal electric discharges and high frequency power leakage. The heating function is achieved through a resistance heater installed on the mounting table rather than through an induction coil in the chamber, thereby reducing device complexity

Inventive Principle:
Principle #2Taking out (Extraction)

2Temperature

If an induction heating unit is installed within the focus ring and an induction coil is installed in the processing chamber, then the focus ring can be heated by magnetic field, but manufacturing costs increase

Engineering Contradiction:
Improvefocus ring temperatureVSAvoidmanufacturing cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent replaces the complex induction heating system with a simpler resistance heating system. The resistance heater is a straightforward electrical component that can be manufactured and installed more economically than an induction coil system, thereby reducing manufacturing costs while achieving the same heating function

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The resistance heater used in the patent is a simpler, more economical component compared to the induction heating unit. By using a resistance heater that can be easily manufactured and replaced if needed, the patent reduces the overall manufacturing cost of the semiconductor processing apparatus

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Temperature

If a resistance heater is installed for the focus ring, then the focus ring can be heated, but abnormal electric discharge may be generated toward the wiring and high frequency power may leak

Engineering Contradiction:
Improvefocus ring temperatureVSAvoidabnormal electric discharge
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the resistance heater system that causes electric discharge problems with an induction heating system. The induction coil generates a magnetic field that induces eddy currents within the focus ring, heating it without direct electrical contact to the focus ring's wiring, thereby eliminating abnormal electric discharges and high frequency power leakage

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces a magnetic field as an intermediary between the power source and the focus ring. The induction coil generates a magnetic field that penetrates the focus ring and induces heating through eddy currents, without requiring direct electrical connection to the focus ring's wiring, thereby avoiding electric discharge and power leakage issues

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables simple, efficient, and cost-effective heating of components in the processing chamber, reducing manufacturing costs and avoiding the risks of abnormal electric discharges associated with induction heating.

Implementation Method 1

generating heating lights which is generated by a heating light source provided outside the processing chamber and has a wavelength band capable of passing through a first part in the processing chamber and being absorbed into a second part in the processing chamber made of a material different from that of the first part

Methodology Applied
Scientific EffectLight absorption: Absorption (EM radiation)

Implementation Method 2

heating the second part in the processing chamber by passing the heating lights through the first part in the processing chamber and irradiating the heating lights to the second part in the processing chamber

Methodology Applied
Scientific EffectPhotothermal conversion:

Data Source

PatentUS8824875B2Method for heating part in processing chamber of semiconductor manufacturing apparatus and semiconductor manufacturing apparatus
Publication Date: 2014.09.02 TOKYO ELECTRON LTD
  • US8824875B2 patent drawing
  • US8824875B2 patent drawing
  • US8824875B2 patent drawing

AI summary

There is provided a method for heating a part within a processing chamber of a semiconductor manufacturing apparatus having a substrate in the processing chamber and performing a process on the substrate. The heating method includes generating heating lights which is generated by a heating light source provided outside the processing chamber and has a wavelength band capable of passing through a first part in the processing chamber and being absorbed into a second part in the processing chamber made of a material different from that of the first part, and heating the second part in the processing chamber by passing the heating lights through the first part in the processing chamber and irradiating the heating lights to the second part in the processing chamber.