Focus Ring Grading for Uniform Plasma Edge Control
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Solution Overview
Problem
Current substrate processing technologies face challenges in uniformly controlling plasma in the edge region and optimizing component usage for specific processes, leading to reduced yield and inefficiencies.
Innovation Solution
A substrate processing apparatus and method that classify focus rings and other components by grade based on grain size and electrical resistivity, ensuring their appropriate selection and use for specific substrate treatment processes, such as high aspect ratio contact etching, to enhance process control and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If focus rings are used without classification by grade, then device complexity is reduced, but manufacturing precision deteriorates due to non-uniform plasma control
Solution Approach 1:
The patent applies local quality by classifying focus rings into different grades (first grade with grain size ≤14.23μm and resistivity ≤1Ω, second grade with different properties) and assigning specific grades to specific process types. This ensures that each local component (focus ring) has the appropriate quality characteristics for its intended use, achieving uniform plasma control in edge regions for high-aspect-ratio contact holes while using suitable components for standard processes.
2Manufacturing precision
If high-quality focus rings are used for all processes, then manufacturing precision is improved, but loss of substance increases due to waste of high-quality components
Solution Approach 1:
The patent implements parameter changes by establishing specific grain size (≤14.23μm) and electrical resistivity (≤1Ω) parameters for first-grade focus rings, while second-grade rings have different parameter ranges. This parameter-based classification enables matching focus ring quality to process requirements, preventing waste of high-quality rings in standard processes while ensuring adequate quality for high-precision applications.
3Manufacturing precision
If focus rings with specific grain size and resistivity are selected, then manufacturing precision is improved, but ease of manufacture deteriorates
Solution Approach 1:
The patent applies preliminary action by pre-classifying focus rings into grades based on grain size and electrical resistivity before they are installed in the substrate processing apparatus. This advance classification and documentation of component specifications enables traceability and proper selection, ensuring that the correct grade is used for each process type without requiring complex real-time decision-making during manufacturing.
Data Source
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AI summary
A substrate processing method includes classifying a kind of substrate treatment process in which a focus ring is used, classifying a plurality of focus rings, selecting from the classified plurality of focus rings a specific focus ring suitable for a certain substrate treatment process corresponding to the classified kind of substrate treatment process, and performing the certain substrate treatment process using the selected specific focus ring. The operation of classifying the plurality of focus rings includes classifying the plurality of focus rings into two or more grades.