Focus Ring Replacement in Sealed Plasma Process Chambers
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Solution Overview
Problem
The manual replacement of focus rings in plasma processing systems requires opening the process chamber to the atmosphere, leading to prolonged downtime and reduced productivity due to the inability to process substrates during the replacement process.
Innovation Solution
A method involving a transfer device to replace focus rings within the plasma processing system without opening the process chamber to the atmosphere, including steps for transferring out the worn focus ring, cleaning the mount table, and introducing a new focus ring, all controlled by a processor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If manual replacement of focus ring is performed by opening the process chamber to the atmosphere, then the focus ring can be replaced, but the replacement time increases and productivity decreases
Solution Approach 1:
The patent applies the inert atmosphere principle by maintaining the process chamber in a sealed state with controlled atmosphere during focus ring replacement. The transfer device operates within the closed chamber environment, preventing exposure to atmospheric conditions that would require chamber opening. This allows focus ring replacement to proceed without breaking the vacuum or sealing, thereby maintaining substrate processing continuity and eliminating downtime associated with chamber venting and re-pumping.
2Ease of operation
If the process chamber is opened to the atmosphere for focus ring replacement, then the focus ring can be accessed, but the time required for replacement increases
Solution Approach 1:
The patent employs an intermediary approach by introducing a transfer device that acts as a mediator between the operator and the focus ring. The transfer device includes a holder that can grasp and manipulate the focus ring within the sealed chamber environment. This intermediary mechanism allows operators to replace focus rings without directly accessing them by opening the chamber, thereby reducing replacement time while maintaining ease of operation through automated or semi-automated handling.
Solution Approach 2:
The transfer device is segmented into multiple functional components including a holder, grasping mechanism, and transfer path. This segmentation allows the replacement operation to be broken down into discrete steps that can be performed efficiently within the sealed chamber. The modular design enables the transfer device to navigate around other chamber components and access the focus ring through a controlled path, reducing the time required for replacement while maintaining chamber integrity.
3Ease of manufacture
If manual replacement method is used, then focus ring can be replaced, but contamination risk increases and productivity is reduced
Solution Approach 1:
The patent maintains a sealed, controlled atmosphere within the process chamber during focus ring replacement. The transfer device operates entirely within this protected environment, preventing atmospheric contaminants from entering the chamber. This eliminates the contamination risk associated with opening the chamber to atmosphere, while still enabling focus ring replacement through the intermediary transfer mechanism.
Data Source
AI summary
A method performed by a processor of a plasma processing system including a transfer device and a plasma processing apparatus that includes a process chamber. The process chamber includes a mount table on a surface of which a first focus ring is placed. The method includes controlling the transfer device to transfer the first focus ring out of the process chamber without opening the process chamber to the atmosphere; after the first focus ring is transferred out of the process chamber, controlling the plasma processing apparatus to clean the surface of the mount table; and after the surface of the mount table is cleaned, controlling the transfer device to transfer a second focus ring into the process chamber and place the second focus ring on the surface of the mount table without opening the process chamber to the atmosphere.


