Focused Ion Beam Apparatus for Automated TEM Sample Processing
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Solution Overview
Problem
The miniaturization of semiconductor device structures has led to challenges in manufacturing TEM samples with uniform quality, requiring high technical expertise and varying skill levels among workers, which complicates the process and affects uniformity and efficiency.
Innovation Solution
A focused ion beam apparatus with a storage unit to store positional relations between processing areas and cross-section surfaces, allowing for automatic setting of processing areas on new samples based on stored configuration information, enabling easier operation and consistent sample quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual processing area setting is used by multiple workers with different technical levels, then flexibility in operation is maintained, but uniformity of sample quality deteriorates
Solution Approach 1:
The patent stores the positional relationship between the processing area and cross-section surface from a reference sample in a storage unit. This copied positional information is then applied to subsequent samples, allowing workers to reproduce the same processing area settings without requiring high technical expertise, thereby ensuring uniform sample quality across different operators.
Solution Approach 2:
The patent performs preliminary measurement and storage of the positional relationship between processing areas and cross-section surfaces on reference samples. This pre-acquired information is stored and automatically applied to future samples, eliminating the need for repeated manual measurement and setting by workers with varying skill levels.
2Manufacturing precision
If high technical level is required to manufacture TEM samples with smaller film thicknesses, then sample quality can be maintained, but work time increases and productivity decreases
Solution Approach 1:
The system performs automatic processing area setting by retrieving stored positional relationship data and applying it to new samples without requiring manual intervention. This self-service capability eliminates the need for workers to have high technical expertise, allowing anyone to produce high-quality TEM samples efficiently.
Solution Approach 2:
The patent replaces manual mechanical measurement and setting operations with an automated information processing system. The storage unit and processing unit automatically handle the complex task of determining processing areas, substituting human technical skill with automated computational methods.
3Adaptability or versatility
If multiple workers with different technical levels operate the FIB-SEM apparatus, then operational flexibility is maintained, but the complexity of managing varying skill levels increases
Solution Approach 1:
The patent creates a universal system that works for all operators regardless of their technical level. By storing and reusing positional relationship data, the system provides a standardized method that any worker can follow, making the apparatus equally effective for both novice and experienced operators without requiring complex training or management protocols.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures the production of TEM samples with uniform quality by automating the processing area setting, reducing the technical expertise required and shortening the manufacturing time, while maintaining precision and accuracy across different operators.
Implementation Method 1
a detector configured to detect secondary particles generated from the sample due to the irradiation with the focused ion beam
Data Source
AI summary
A focused ion beam apparatus includes: a focused ion beam tube configured to irradiate a focused ion beam onto a sample; a detector configured to detect secondary particles generated from the sample due to the irradiation and to output detection information regarding detected secondary particles; an image forming unit configured to form an observation image of the sample based on the detection information; a storage unit configured to store positional relation between a first processing area set on an observation image of a first sample and a cross-section surface of the first sample; and a processing area setting unit configured to automatically set a second processing area on an observation image of a second sample based on the positional relation stored in the storage unit and a position of a cross-section surface of the second sample on the observation image of the second sample.