Focused Ion Beam Control Method for Large Area Processing Deviation Correction
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Solution Overview
Problem
Focused ion beam (FIB) devices face challenges in correcting processing positional deviation and size deviation during large area processing, such as in micro electro mechanical systems (MEMS) production, where the processing area exceeds the maximum screen range, leading to inaccuracies and deviations in film formation and etching.
Innovation Solution
A method involving the measurement of secondary electronic image luminance profiles to detect the edges of processed figures, allowing for precise adjustment of the beam application position and correction of positional and size deviations by integrating luminance data in specific directions, enabling accurate large area processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If processing is performed on an area exceeding the maximum range of vision of the screen, then large area processing capability is achieved, but processing positional deviation and processing size deviation occur
Solution Approach 1:
The patent divides the large area processing into multiple processing regions that can be sequentially processed. After processing each region, the system measures the actual processed figure and uses this information to determine the position of the next processing region, effectively segmenting the overall processing task into manageable portions while maintaining accuracy across the entire large area.
Solution Approach 2:
The patent implements a feedback mechanism where the actual processed figure is measured after each processing step, and this measurement information is fed back to determine the position and parameters of the next processing region. This closed-loop control corrects for positional and size deviations that occur during large area processing, ensuring manufacturing precision is maintained across the entire processing area.
2Area of stationary object
If processing is performed on an area exceeding the maximum range of vision of the screen, then large area processing capability is achieved, but processing size deviation occurs
Solution Approach 1:
The patent segments the large area processing into multiple smaller processing regions, each within the maximum range of vision. By processing region by region and measuring the actual processed figure after each step, the system can detect and correct size deviations before they accumulate across the entire large area, maintaining processing size accuracy throughout.
Solution Approach 2:
The patent uses feedback from actual measurements of processed figures to adjust subsequent processing parameters. The measured size of each processed figure is used to determine the position and size of the next processing region, creating a self-correcting system that compensates for size deviations and maintains manufacturing precision across large areas.
3Area of stationary object
If the processing region is divided into multiple specimen images, then coverage of large areas is achieved, but processing positional deviation occurs between regions
Solution Approach 1:
The patent implements feedback by measuring the actual processed figure in each specimen image region and using this information to determine the position of the next processing region. This ensures accurate positional alignment between regions by basing the next position on actual measured positions rather than relying solely on predetermined coordinates, thereby correcting positional deviations.
Solution Approach 2:
The patent performs preliminary measurement of the processed figure before determining the next processing position. This preliminary action of measuring and using the results to plan the next step ensures that positional deviations are corrected proactively rather than reactively, maintaining alignment accuracy across multiple specimen images.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively corrects processing positional and size deviations, ensuring in-plane uniformity and positional accuracy in FIB processing, preventing overlapping and gaps in large area film formation and etching, thereby improving the quality of microstructures like MEMS.
Implementation Method 1
application of a focused ion beam in a first processing range of vision to form a first processed figure on a surface of a specimen
Implementation Method 2
obtaining a secondary electronic image through the application of a focused ion beam
Data Source
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AI summary
To provide a technique for correcting processing positional deviation and processing size deviation during processing by an FIB. A focused ion beam device control method includes: the step of forming a first processed figure on the surface of a specimen through the application of a focused ion beam in a first processing range of vision (S102); the step of determining the position of a next, second processing range of vision based on the outer dimension of the first processed figure measured in a secondary electron image obtained by application of the ion beam (S103); the step of detecting size deviation with respect to the design dimension of the first processed figure (S104, S105); and the step of moving a stage to the position of the second processing range of vision thus determined (S106, S107). Further, the control method includes the step of forming a second processed figure through the application of the focused ion beam in a second processing range of vision (S108).