Focusing Ring Container Alignment for Stable Etching Placement
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Solution Overview
Problem
The existing substrate treating apparatuses face challenges in precisely aligning and seating expendable components and sensors in the process chamber, leading to deviations in etching characteristics and the need for frequent replacement of focusing rings.
Innovation Solution
A container with a support part that includes alignment pins and detachable alignment blocks, which are inserted into support slots and guide pins to align and secure expendable components and sensors, ensuring precise placement and minimizing changes in their location during transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If an operator directly carries the new focusing ring into the ring pod, then the transfer process is simple and fast, but the location of the focusing ring cannot be precisely controlled and may deviate from the proper location
Solution Approach 1:
The patent introduces an intermediary alignment mechanism consisting of alignment pins and alignment blocks that mediate between the operator's manual placement and the required precise location. The alignment pins are inserted into corresponding holes in the focusing ring, and the alignment blocks with guide pins guide the focusing ring to the correct position in the ring pod, eliminating the need for operator skill while maintaining simplicity.
Solution Approach 2:
The alignment blocks are pre-installed in the ring pod at specific locations before the focusing ring is transferred. The alignment pins are pre-positioned on the focusing ring. This preliminary arrangement of alignment features ensures that when the focusing ring is placed in the ring pod, the alignment mechanism automatically guides it to the correct position without requiring precise manual placement by the operator.
2Adaptability or versatility
If the location of the focusing ring in the ring pod is not precisely aligned, then the transfer process is more flexible, but the new focusing ring cannot be seated at the desired location in the process chamber
Solution Approach 1:
The patent replaces the reliance on operator skill and manual alignment with a mechanical alignment system. The alignment pins fit into corresponding holes in the focusing ring, and the guide pins in the alignment blocks mechanically guide the focusing ring to the correct position. This mechanical substitution ensures reliable and repeatable positioning regardless of operator variability.
Solution Approach 2:
The alignment mechanism enables the focusing ring to self-align and self-position itself in the ring pod. The alignment pins on the focusing ring automatically engage with the alignment blocks' guide pins, causing the focusing ring to automatically locate itself at the correct position without requiring external adjustment or precise manual placement.
3Device complexity
If manual alignment is used, then the device complexity is low, but the etching characteristics cannot be precisely controlled
Solution Approach 1:
The patent applies local quality by adding alignment features only at specific critical locations rather than throughout the entire focusing ring or ring pod. Alignment pins are positioned at key locations on the focusing ring, and alignment blocks are placed at corresponding locations in the ring pod. This localized approach provides precise control with minimal added complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise alignment and seating of expendable components and sensors, maintaining consistent etching characteristics and reducing the frequency of focusing ring replacements by ensuring accurate placement and minimizing contamination between used and unused components.
Implementation Method 1
the support part includes an alignment pin that aligns the expendable component
Implementation Method 2
an alignment block installed in the support slot to be detachable, and having the alignment pin
Implementation Method 3
The plasma is generated by very high temperature, strong electric fields, or radio frequency (RF) electromagnetic fields. A semiconductor device manufacturing process may include an etching process of removing a thin film formed on a substrate, such as a wafer, by using plasma. The etching process is performed as ions and/or radicals contained in plasma collide a thin film on a substrate or react with a thin film.
Data Source
AI summary
Disclosed is a container. The container includes a housing having an interior space, and a support part that supports an expendable component in the interior space, and the support part includes an alignment pin that aligns the expendable component.